Process Integration Engineer (Writer) (49947)

Headway Technologies; Milpitas (CA); On-site; USD 121,000 - 160,000; Full time

Job summary

Headway Technologies is seeking a Process Integration Engineer (Writer) in Milpitas, CA to drive chip process integration and characterization for new technology programs. You will perform wafer-level characterization, investigate failures with corrective actions, and monitor backend performance data to optimize processes.

The role requires strong JMP data analysis skills, FIB-based evaluation, and collaboration with cross-functional teams.

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics (or equivalent).
• Six years in process integration/characterization in semiconductor environment.
• Experience with JMP or similar analytical apps.
• Proficient with Microsoft Office applications.

Responsibilities

• Develops process integration and characterization techniques for new programs.
• Performs wafer level process characterization and failure analysis; recommends corrective actions.
• Analyzes backend performance data and suggests improvements.
• Designs experiments to verify process robustness and reports findings.
• Uses JMP or similar tools to identify root causes of variations and present results.

Skills

JMP

MS Excel

Root cause analysis

Communication

Time management

Education

Bachelor’s degree in Electrical Engineering/Materials Science/Physics

Master’s or PhD preferred

Tools

FIB tool

Microsoft Office

Job description

Job Details

Job Location: Milipitas, CA 95035

Position Type: Full Time

Education Level: 4 Year Degree

Salary Range: $121,000.00 - $160,000.00 Salary/year

Job Shift: Days

TITLE: PROCESS INTEGRATION ENGINEER (WRITER)

FLSA STATUS: EXEMPT

REPORTS TO: MANAGER, WRITER INTEGRATION

SUMMARY:

Under the direction of the Manager of Writer Integration, the Process Integration Engineer (Writer) is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Develops and delivers process integration and characterization techniques for new technology programs and next generation products


• Conducts failure analysis on newly developed processes and recommends corrective action if necessary


• Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe


• Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool to identify defects and recommends corrective action


• Reviews and analyzes backend performance data and makes recommendations to improve performance


• Designs and conducts experiments to verify process robustness; analyzes data and reports findings


• Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams


• Responds to inquiries from other team members, managers, or departments


• Adheres to all safety policies and procedures as required


• Performs other duties of a similar nature or level*

QualificationsMINIMUM QUALIFICATIONS:

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred


• Six years of hands‑on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering role


• Hands‑on experience using JMP or similar analytical application


• Proficient in the use of Microsoft Office Applications

Required Knowledge, Skills, and Abilities:

• Knowledge of process integration and characterization principles, practices, and techniques


• Knowledge of magnetic recording head or HDD manufacturing


• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations


• Able to design experiments, analyze results, and recommend corrective action


• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management


• Able to work productively and collaboratively with all levels of employees and management


• Able to comply with all safety policies and procedures


• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements


• Demonstrated analytical skills


• Demonstrated organizational and time management skills


• Demonstrated problem-solving and trouble shooting skills


• Flexible and able to prioritize

The annual rate for this full-time position is between $121,00000-$160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Process Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.

*Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.