Process Engineering Intern - Paste-Packaging (Spring/Summer 2027)

Henkel Corporation; Bay Point (CA); On-site; USD 28,000 - 34,000; Full time

Benefits offered by this job

Housing stipend/relocation support

Online learning platform access

Networking events with leaders

Job summary

Henkel Corporation is seeking a Process Engineering Intern for the Spring or Summer 2027 term in the United States. The role falls under Adhesive Technologies Engineering and focuses on packaging and process improvement in a real-world manufacturing setting.

You will gain hands-on experience, support production on the floor, and contribute to continuous improvement projects while developing technical writing and data-analysis skills.

Qualifications

• Undergraduate student graduating in 2027 or 2028 pursuing a degree in Chemical, Mechanical, Packaging, or Industrial Engineering.
• Strong problem-solving and data interpretation skills.
• Solid technical writing and documentation skills.

Responsibilities

• Gain hands-on experience in a real-world manufacturing environment.
• Provide production floor support to ensure smooth operations.
• Contribute to continuous improvement projects focusing on efficiency and quality.
• Write and edit manufacturing instructions and standard operating procedures.
• Assist in resolving non-conformances and implementing corrective actions.
• Network with experienced engineers and contribute to meaningful innovations.

Skills

Problem solving

Data analysis

Attention to detail

Documentation

Independent work

Microsoft Office

Education

Chemical Engineering

Mechanical Engineering

Packaging Engineering

Industrial Engineering

Tools

Microsoft Excel

Microsoft Word

PowerPoint

Job description

Henkel Corporation is seeking a Process Engineering Intern for the Spring or Summer 2027 term in the United States. The role falls under Adhesive Technologies Engineering and focuses on packaging and process improvement in a real-world manufacturing setting.

You will gain hands-on experience, support production on the floor, and contribute to continuous improvement projects while developing technical writing and data-analysis skills.