Process Engineering Intern: Lean, Data-Driven Thin Films

Tokyo Electron US

San Jose (CA)

On-site

USD 28,000 - 41,000

Full time

13 hours ago
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Job summary

TOKYO ELECTRON AMERICA, INC. in San Jose, CA, invites applications for a Summer 2027 Internship on the Thin Films development team. The program emphasizes meaningful project work, Lean thinking, and hands-on experience within a research and development environment.

Ideal candidates are grad students (M.S. or Ph.D. preferred, rising Juniors or Seniors also considered) in Physics, Materials Science, Mechanical, Electrical, or Chemical Engineering who can contribute with DOE, CAD, data analytics,

Qualifications

  • Background in physics, materials science, mechanical, electrical, or chemical engineering.
  • Experience with DOE and statistical analysis is highly desired.
  • Strong collaboration and communication skills.

Responsibilities

  • Design and conduct process DOEs for process optimization
  • Analysis and data assimilation of tool signal data and metrology results.
  • Supervised work on plasma diagnostics and integration of diagnostic signals with tool and metrology data.
  • Construct reduced order models (ROMs) of chamber hardware and validate with tool signal data.
  • Simulate EM fields and plasmas using commercial codes.
  • Supervised work in TEL lab including sample preparation and data collection

Skills

Design of Experiments
Statistical methods
Coding
Machine learning basics

Education

MS/PhD preferred
Bachelor’s level considered

Tools

CAD
Plasma/fluids simulation tools

Job description

TOKYO ELECTRON AMERICA, INC. in San Jose, CA, invites applications for a Summer 2027 Internship on the Thin Films development team. The program emphasizes meaningful project work, Lean thinking, and hands-on experience within a research and development environment.

Ideal candidates are grad students (M.S. or Ph.D. preferred, rising Juniors or Seniors also considered) in Physics, Materials Science, Mechanical, Electrical, or Chemical Engineering who can contribute with DOE, CAD, data analytics,

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