Principal Technical Program Manager (AWS)

Amazon Inc.

Austin (TX)

On-site

USD 177,000 - 239,000

Full time

4 days ago
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Job summary

Amazon Inc. through Annapurna Labs is seeking a Principal Technical Program Manager to own end-to-end program execution for a multi-die ML accelerator chip.

You will connect engineering workstreams into a coherent schedule, identify critical paths, and drive cross-functional decisions to keep the program on track across RTL, DV, physical design, packaging, and infrastructure domains. You will lead weekly status cadences, manage external design partners, and drive infrastructure readiness for

Qualifications

  • 10+ years of hands-on experience managing complex technology projects.
  • 10+ years of working directly with engineering teams.
  • Deep knowledge of RTL verification milestones, physical design convergence, DFT, and timing closure.
  • Experience managing programs with external design partners and IP vendors.
  • Ability to build and maintain integrated schedules with real dependency modeling.

Responsibilities

  • Own the integrated schedule and critical path analysis across multiple die tape-outs through engineering samples and production ramp.
  • Drive the weekly chip status cadence by synthesizing inputs from RTL/DV, physical design, packaging, power, infrastructure, and post-silicon teams.
  • Track verification convergence from feature completion through RTL closure, bug trends, and regression pass rates by block.
  • Manage the external design partner interface, owning netlist delivery calendar and schedule trades with cost awareness.
  • Drive infrastructure readiness and external IP delivery by partnering with compute and EDA teams on capacity planning.

Skills

Program management
Engineering collaboration
Chip development lifecycle
External partner management
Schedule modeling
Technical communication

Job description

Annapurna Labs designs the custom silicon that powers AWS's machine learning infrastructure, including the Trainium and Inferentia chip families. Our next-generation ML accelerator is a multi-die chiplet using state-of-the-art packaging technology, and it is the most complex hardware program Amazon has undertaken. We are looking for a Principal Technical Program Manager to own end-to-end program execution for this chip, from RTL freeze through tape-out and into production readiness.

This is not a status-reporting role. You will be the person who connects a sprawling set of engineering workstreams into a single coherent schedule, identifies the real critical path week to week, and drives the cross-functional decisions that keep the program on track. The program spans multiple concurrent silicon development efforts with significant interdependencies across engineering disciplines, external partners, and infrastructure.

Key job responsibilities
  • Own the integrated schedule and critical path analysis across multiple die tape-outs through engineering samples and production ramp. Understand dependency chains deeply enough to calculate the impact of any slip or pull-in, and update the timeline weekly with real data.
  • Drive the weekly chip status cadence by synthesizing inputs from RTL/DV, physical design, packaging, power, infrastructure, and post-silicon teams into a single view that tells leadership where we actually stand, including what is getting worse and what needs action.
  • Track verification convergence as a leading indicator by monitoring the progression from feature completion through RTL closure, bug trends, and regression pass rates by block. Recognize when convergence is stalling and drive the engineering response before downstream milestones are affected.
  • Manage the external design partner interface, owning the netlist delivery calendar, tracking your partner's physical design timeline, and negotiating schedule trades with a clear understanding of downstream cost.
  • Drive infrastructure readiness and external IP delivery by partnering with compute and EDA platform teams on capacity planning, and tracking third-party PHY, memory interface, and controller IP deliveries against consuming blocks to escal gaps before they become tape-out critical.
A day in the life

You start your morning reviewing verification convergence dashboards and regression results, spotting a block where bug closure rates haven't flattened. You pull the DV lead and RTL owner into a quick sync to agree on a recovery plan before the weekly chip status review. In that review, you walk leadership through an updated critical path that reflects a netlist delivery shift from your external design partner, quantifying the downstream impact on tape-out timing. After lunch, you join an infrastructure capacity review to confirm that compute clusters can handle the regression load through freeze, then close out the day preparing an executive summary for an upcoming program milestone review.

About the team

The Annapurna Labs ML Accelerator team builds the Trainium and Inferentia silicon that trains and serves machine learning models across AWS. We work at the intersection of chip architecture, physical design, verification, and infrastructure to deliver products that push the boundaries of performance and efficiency for our customers. Our team values people who bring strong technical judgment, clear communication, and a willingness to get into the details. If you want to shape how Amazon builds its most ambitious hardware and work alongside talented engineers solving real problems at scale, this is the role for you.

Basic Qualifications
  • 10+ years of hands-on work managing complex technology projects experience
  • 10+ years of working directly with engineering teams experience
  • Deep working knowledge of the chip development lifecycle: RTL verification milestones, physical design convergence, DFT, and timing closure.
  • Experience managing programs with external design partners and IP vendors where you don't control the resources but own the outcome.
  • Demonstrated ability to build and maintain integrated schedules with real dependency modeling — not just Gantt charts, but an understanding of which paths have float and which don't.
  • Strong technical communication skills: ability to present crisp status to VP-level audiences, distinguishing signal from noise, and framing decisions clearly.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&DD insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits .

Preferred Qualifications
  • Experience with multi-die / chiplet / advanced packaging programs (2.5D/3D integration).
  • Familiarity with HBM integration, die-to-die interfaces, or high-speed serial subsystems.
  • Experience with leading-edge foundry nodes and their specific flow and schedule characteristics.
  • Background in ML accelerator or high-performance compute silicon.
  • Experience driving infrastructure capacity planning for large-scale chip development programs.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&DD insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits .

USA, CA, Cupertino - 203,500.00 - 275,300.00 USD annually
USA, TX, Austin - 177,000.00 - 239,400.00 USD annually

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