Principal Engineer – Thin-Film & Process Engineering

Ensurge Inc.; San Jose (CA); Hybrid; USD 200,000 - 250,000; Full time

Job summary

Ensurge Micropower is seeking a Principal Engineer to lead thin-film deposition and process engineering, focusing on sputtering/PVD integration into scalable microbattery manufacturing. The role emphasizes developing robust processes, DOE-driven optimization, and cross-functional collaboration across design, materials, and equipment teams.

The successful candidate will drive yield, repeatability, and process capability, transferring R&D advances into pilot and manufacturing environments while

Qualifications

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or related field.
• 8+ years of relevant engineering experience.
• Deep hands-on experience with sputtering/PVD and thin-film process development.
• Experience developing process windows and improving manufacturing yield.
• Strong technical communication and documentation skills.

Responsibilities

• Lead development and optimization of sputtering/PVD processes for microbattery electrodes and other functional layers.
• Develop robust process recipes and establish robust operating windows.
• Optimize deposition parameters including power, pressure, gas flow, substrate temperature, deposition rate, target condition, and substrate configuration.
• Establish process windows, capability, and controls; drive yield improvements.
• Transfer laboratory processes into pilot and manufacturing environments; collaborate with cross-functional teams.

Skills

Sputtering/PVD

DOE & statistics

Process optimization

Root-cause analysis

Technical communication

Education

Bachelor's or Master's in Materials Science or related field

Tools

Vacuum systems

Deposition equipment

Patterning/etching equipment

Job description

About Ensurge

Ensurge Micropower is developing next-generation solid-state microbatteries using advanced thin-film and semiconductor-compatible manufacturing technologies. Our technology platform combines sputtering, thin-film materials, precision patterning, multilayer stacking, and advanced cell architectures. We are seeking a Principal Engineer – Thin-Film & Process Engineering to serve as a technical leader for the development, optimization, and scale-up of our thin-film and cell manufacturing processes. This is a highly hands-on role for an engineer with deep expertise in sputtering/PVD, thin-film processing, process optimization, DOE, and manufacturing scale-up.

Role Overview

The Principal Engineer will be the technical owner for thin-film deposition and process engineering, with particular emphasis on sputtering/PVD processes and their integration into the overall microbattery manufacturing flow.

The successful candidate will be responsible for developing robust processes, establishing process windows, troubleshooting complex process issues, improving yield and repeatability, and transferring processes from R&D into scalable manufacturing.

This individual will work closely with cell design, materials, equipment, characterization, and manufacturing teams.

Key Responsibilities

Sputtering & Thin-Film Process Development

• Lead development and optimization of sputtering/PVD processes for microbattery electrodes, electrolytes, current collectors, barriers, and other functional layers.
• Develop process recipes and establish robust operating windows.
• Optimize deposition parameters including power, pressure, gas flow, substrate temperature, deposition rate, target condition, and substrate configuration.
• Understand and control film thickness, composition, density, stress, adhesion, morphology, uniformity, and electrical/electrochemical properties.
• Develop strategies to improve film uniformity across substrates and through production runs.
• Troubleshoot sputtering chamber and process-related issues.
• Partner with equipment engineering to improve chamber performance, uptime, throughput, and repeatability.

Process Optimization

• Lead structured DOE and statistical process optimization.
• Identify critical process parameters and critical-to-quality characteristics.
• Establish process windows and operating limits.
• Analyze process data to identify sources of variation and yield loss.
• Develop corrective and preventive actions based on data and root-cause analysis.
• Establish process capability and statistical controls for critical processes.
• Drive continuous improvement in yield, throughput, quality, and reliability.

Thin-Film Materials & Characterization

• Correlate deposition parameters with thin-film properties and cell performance.
• Partner with materials and characterization teams to investigate film composition, structure, density, stress, adhesion, and interfaces.
• Use characterization techniques such as SEM, XRD, XPS, profilometry, EIS, optical microscopy, and other appropriate analytical methods.
• Develop failure-analysis approaches for deposition and interface-related defects.
• Translate characterization results into process improvements.

Process Integration

• Work closely with the cell design team to ensure cell architecture is compatible with manufacturing capabilities.
• Define process requirements and limitations that should influence cell design.
• Develop integrated process flows covering deposition, patterning, stacking, assembly, and testing.
• Identify interactions between individual process steps and downstream cell performance.
• Optimize the complete process rather than individual steps in isolation.

Manufacturing Scale-Up

• Transfer laboratory processes into pilot and manufacturing environments.
• Develop scalable processes with appropriate controls and specifications.
• Establish process documentation, specifications, work instructions, and control plans.
• Support equipment selection, qualification, commissioning, and process validation.
• Develop methods to monitor process stability and detect process drift.
• Work with operations and manufacturing engineering to improve throughput and yield.

Technical Problem Solving

• Lead root-cause investigations for process and product failures.
• Develop hypotheses, design experiments, analyze data, and implement corrective actions.
• Provide technical leadership during high-priority manufacturing and development issues.
• Ensure high-quality data and reproducible experiments support conclusions.

Technical Leadership

• Serve as the principal technical authority for thin-film and process engineering.
• Establish process-development methodologies and engineering standards.
• Mentor process engineers and technicians.
• Review process-development plans and experimental strategies.
• Provide technical direction across cross-functional development programs.
• Communicate process capability, risks, opportunities, and recommendations to engineering leadership.

Required Qualifications

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or related field.
• 8+ years of relevant engineering experience.
• Deep hands-on experience with sputtering/PVD and thin-film process development.
• Demonstrated experience developing and optimizing manufacturing processes.
• Strong understanding of thin-film deposition physics and process-property relationships.
• Experience with DOE, statistical analysis, process capability, and structured root-cause analysis.
• Experience developing process windows and improving manufacturing yield.
• Experience troubleshooting vacuum systems, deposition equipment, or semiconductor/thin-film manufacturing equipment.
• Ability to work hands-on with equipment and materials in a laboratory or manufacturing environment.
• Strong technical communication and documentation skills.

Preferred Qualifications

• Experience with solid-state batteries, thin-film batteries, microbatteries, MEMS, semiconductor manufacturing, or advanced energy-storage technologies.
• Experience with LiPON, LiCoO₂, lithium metal, Ni/NiV, TiN, Cu, Al, stainless steel, or related thin-film materials.
• Experience with multilayer thin-film structures.
• Experience with R2R sputtering or other continuous manufacturing processes.
• Experience with photolithography, patterning, etching, or other microfabrication processes.
• Experience with process scale-up and equipment qualification.
• Experience establishing SPC and manufacturing process controls.
• Experience working in a startup environment.

Key Attributes

• Deep technical expertise in thin films and sputtering.
• Highly hands-on and comfortable troubleshooting equipment and processes.
• Strong experimental and data-analysis skills.
• Naturally thinks in terms of process windows, variation, yield, and repeatability.
• Strong root-cause problem solver.
• Understands the interaction between materials, process, equipment, and product performance.
• Able to move quickly from hypothesis to experiment to implementation.
• Strong technical leader who can influence cross-functional teams.
• High ownership and accountability.

Salary Range

$200,000-$250,000

The base salary range is specific to California. The final salary for the selected candidate will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.