Principal Engineer – Electronics (REQ 320)

APPLIED PHYSICAL SCIENCES CORP; Groton (CT); On-site; USD 120,000 - 150,000; Full time

Job summary

A technology firm in Connecticut is seeking a Principal Engineer – Electronics to join their Sensing and Communications Department. The ideal candidate will have significant experience in designing multi-layer PCBs and managing complex projects in a multidisciplinary environment. Responsibilities include leading teams on DoD programs, troubleshooting systems, and collaborating across engineering disciplines. Competitive salaries and excellent benefits are offered, along with a requirement for a DoD security clearance.

Qualifications

• 12+ years of relevant experience in microelectronics and circuit design.
• Experience managing complex electronic projects.
• Strong understanding of low-noise electronics design.

Responsibilities

• Design and sustain complex electrical ocean systems.
• Lead teams for DoD programs and proposal teams.
• Support engineering design reviews and travel for exercises.

Skills

Designing complex, multi-layer high-density PCBs

Analog sensors

Embedded processors

Digital signal processing

Troubleshooting PCBs and electronics assemblies

Interfacing with Linux based systems

Education

S.E.E. degree with 12+ years of experience

M.S.E.E. degree with 9+ years of experience

Ph.D. E.E. degree with 6+ years of experience

Tools

Digital multi-meter

Oscilloscope

Function generator

Job description

Principal Engineer – Electronics (REQ 320)

Applied Physical Sciences (APS) is seeking a highly motivated principal-level Electronics Engineer to join our Sensing and Communications Department. Successful candidates will have a BS, MS, or PhD degree in electrical engineering with a focus in analog and digital circuit design. Successful applicants will support the design and development, troubleshooting, production, and sustainment of a wide variety of underwater maritime electrical and electromechanical systems. Candidates must have a proven track record of designing and implementing custom PCBs, preferably for prototype R&D systems. Experience should include designing mixed signal PCBs with ADCs & DACs, microcontrollers, DC/DC converters, digital communications protocols (RS232/RS422, I2C, I2S, SPI, McBSP), high speed signaling, signal conditioning, preamplifiers, power amplifiers, energy storage and power management, and interfacing to embedded microprocessors. Previous experience laying out boards and/or managing vendors which provide layout services is highly desired. Laboratory experience with power supplies, multimeters, oscilloscopes, and data acquisition systems is required, including experience with integration and testing of PCBs, electronics components and systems. Candidates should be able to participate in a multi-disciplinary team environment with other engineering disciplines to solve technical and logistical problems.

Job Functions and Responsibilities

• Design, integration, troubleshooting, production, and sustainment of complex electrical and electro-mechanical ocean systems.
• Design, procurement, and testing of high complexity mixed-signal PCBs with advanced processors, high speed peripherals, and data acquisition circuitry that is low-power and low-noise.
• Manage electronics or multidiscipline integrated product team (IPT) supporting one or more large DoD programs.
• Lead and/or participate in significant proposal capture teams providing innovative technical concepts to complex problems.
• Provide support for a broad range of engineering design reviews including system architectures, electronic schematics/layouts, safety, and system deployment/employment.
• Travel to support exercises.
• Support recruiting initiatives and mentoring of junior staff.

Required Skills and Attributes

• S.E.E. degree with 12+ years of relevant experience, M.S.E.E. degree with 9+ years’ experience, or Ph.D. E.E. degree with 6+ years’ experience with a concentration in microelectronics and circuit design.
• Extensive experience designing complex, multi-layer, high-density PCBs is essential.
• Extensive designing with analog sensors, ADCs, and embedded processors.
• Extensive experience with, or oversight of, electronic layout, bill-of-materials, and assembly process.
• Experience as an IPT leader and/or managing projects of significant complexity.
• Experience with offshore field testing.
• Strong understanding of digital signal processing techniques and processes.
• Extensive experience with low noise and low power electronics design.
• Extensive experience or familiarity with electronics assembly, wiring, crimping, and soldering.
• Proficiency with electronic laboratory test equipment including digital multi-meter, oscilloscope, function generator, digital voltage and current measurement probes.
• Extensive experience troubleshooting printed circuit boards and electronics assemblies including cables, sensors, grounding, and noise.
• Ability to grasp, organize, and communicate complex concepts both electrical and organizational and interface with multi-disciplinary team.
• Basic proficiency interfacing with Linux based systems.
• Basic competence with Matlab data analysis.

Preferred Skills and Attributes

• S. or PhD in Electrical Engineering with a concentration in microelectronics and circuit design.
• Prior experience designing electronics for underwater maritime systems.
• Prior experience creating technical content for new products, ideas, or other business development pursuits.
• Experience working in an R&D environment and working in small multidisciplinary teams.
• Experience mentoring junior EE staff on electronics design, PCB implementation, and board troubleshooting.
• Experience briefing customers.
• Experience with C/C++ coding for microcontrollers (or similar e.g. Python).

Competitive salaries and excellent benefits offered.

Candidates must possess or be able to obtain a DoD security clearance.

EOE: Vet/Disability