Principal AI Forward Deployment Engineer

Cadence Design Systems, Inc.; Oregon; Hybrid; USD 180,000 - 260,000; Full time

Job summary

Cadence Design Systems, Inc. in Portland, OR seeks a Principal AI Forward Deployment Engineer to embed with strategic semiconductor customers and operationalize Cadence's AI tooling across end-to-end silicon design flows.

This senior, customer-facing role translates front-end, physical design, and methodology workstreams into measurable productivity gains powered by flagship LLMs and Cadence AI tooling. You will be the trusted technical lead, turning AI for chip design from a promise into a

Qualifications

• BS/MS/PhD in EE, ECE, CS, or related discipline.
• 10+ years of hands-on semiconductor / chip design experience in front-end design, physical design, CAD/methodology flow, or leadership on production tape-outs.
• Deep fluency with industry EDA flows; personally shipped silicon.
• Proven ability to apply LLMs/AI tools to engineering work (agent-based debug, code/RTL generation, automation, copilots, RAG).
• Excellent customer-facing communication with staff RTL engineers, PD methodology leads, and CAD/design-enablement leaders.
• Bias to action, ownership, and ability to be the single point of contact for customer AI deployment.
• Based in or willing to relocate to Portland, OR; on-site as required.

Responsibilities

• Lead end-to-end deployment of Cadence AI/LLM-powered solutions into customer silicon design flows.
• Architect and tune agentic workflows, prompt strategies, and tool-calling patterns on flagship LLMs to automate EDA tasks.
• Map customer methodology onto Cadence AI building blocks and define ROI-focused insertion points.
• Define and report KPIs; drive pilot-to-production rollout across business units.
• Serve as trusted technical advisor; run design reviews and collect actionable feedback for R&D and AI platform teams.
• Guide secure enterprise LLM access, on-prem vs gateway deployment, and data governance as needed.

Skills

AI deployment leadership

Customer-facing communication

End-to-end silicon design

RAG pipelines / agent workflows

Education

BS/MS/PhD in EE, ECE, CS

Job description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Role Summary

Cadence is hiring a Principal AI Forward Deployment Engineer to embed with strategic semiconductor customers and operationalize Cadence's AI and agentic solutions across their end-to-end silicon design flows. This is a senior, customer-facing applied-AI role for an experienced chip-design practitioner who can translate front-end, physical-design, and methodology workflows into concrete, measurable productivity wins powered by flagship LLMs and Cadence AI tooling. You will be the trusted technical lead at the customer who turns 'AI for chip design' from a slideware promise into a deployed, adopted, and ROI-positive reality.

Why This Role Exists

• Customers are racing to apply LLMs and agentic AI to RTL, verification, implementation, and signoff - but they need a partner who deeply understands *both* their tape-out flows and how to wield modern AI systems.
• This role owns the last mile: taking Cadence AI products (AgentStack, BU Super-Agents, Cadence.AI / JEDAI platform, Cerebrus, Verisium, Allegro X AI, etc.) and making them work inside the customer's actual methodology, PDKs, compute fabric, and security boundaries.
• Success here directly accelerates customer tape-outs, expands Cadence AI footprint, and feeds product roadmaps with real-world signal.

What You Will Do

• Customer-Embedded Deployment. Lead end-to-end deployment of Cadence AI / LLM-powered solutions into the customer's silicon design flows - from RTL design and verification through synthesis, place-and-route, timing, power, signoff, and packaging.
• Applied AI for Chip Design. Architect and tune agentic workflows, prompt strategies, RAG pipelines, and tool-calling patterns on top of flagship LLMs (Claude, GPT, Gemini, Llama, Qwen, etc.) to automate real EDA tasks - debug triage, constraint authoring, ECO loops, PD recipe tuning, methodology Q&A, log/report summarization, and design-review copilots.
• Methodology & Flow Integration. Map customer methodology (FE design, DV, PD, CAD, signoff) onto Cadence AI building blocks; identify the highest-ROI insertion points; build reference flows the customer's CAD/methodology team can own long-term.
• Productivity & ROI Ownership. Define and report KPIs - cycle-time reduction, engineer-hours saved, iteration count, first-pass success, license/compute efficiency. Own the story from pilot to production rollout across BUs and sites.
• Trusted Technical Advisor. Be the senior technical face to customer fellows, methodology leads, and design-team principals. Run design reviews, technical readouts, and joint roadmaps. Translate customer pain into actionable feedback for Cadence R&D and AI platform teams.
• AI Systems Enablement (plus). Where needed, guide customer IT/InfoSec on secure LLM access patterns, on-prem vs. gateway deployment, model routing, prompt/response logging, data-egress controls, and GPU/inference capacity planning.
• Knowledge Multiplier. Capture playbooks, reference designs, and 'golden prompts' so every deployment compounds. Mentor field AEs, FAEs, and customer champions.

Must-Have Qualifications

• BS/MS/PhD in EE, ECE, CS, or related discipline.
• 10+ years of hands-on semiconductor / chip design experience in one or more of: front-end design (RTL, micro-architecture, DV), physical design / implementation (synthesis, P&R, timing, power, signoff), CAD / methodology / flow development, or design execution / project technical leadership on production tape-outs.
• Deep, practitioner-level fluency with industry EDA flows and pain points - you have personally shipped silicon and know where the cycle-time and engineer-time really go.
• Demonstrated ability to apply LLMs / AI tools to get real engineering work done (e.g., agent-based debug, code/RTL generation assist, scripted automation, copilots, RAG over design docs/logs). Doesn't have to be your title - has to be your reflex.
• Excellent customer-facing communication: equally credible with a staff RTL engineer, a PD methodology lead, and a CAD / design-enablement leader.
• Bias to action, ownership, and shipping. Comfortable being the single throat-to-choke for a customer-facing AI deployment.
• Based in or willing to relocate to Portland, OR; able to be on-site at customer locations as the engagement requires.

Nice-to-Have / Bonus

• Prior experience as a Cadence / Synopsys / Siemens EDA customer power user, AE, or methodology architect.
• Hands-on with at least one agentic framework (Claude Code, Cursor, LangGraph, AutoGen, custom MCP/tool-calling stacks) applied to engineering workflows.
• Experience standing up secure enterprise LLM access (gateways, model routing, key management, audit logging) for engineering orgs.
• Familiarity with GPU/inference infrastructure, vLLM/TGI/Triton, fine-tuning / LoRA / SLM workflows, and evaluation harnesses for code/EDA tasks.
• Background in low-power, high-performance, AI/ML, networking, automotive, or HPC silicon programs.
• Public artifacts - papers, talks, OSS, or internal champions - showing applied AI in EDA/silicon contexts.

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