Principal 3D-heterogeneous integration engineer

GlobalFoundries; Essex Junction (VT); Sur place; USD 85 000 - 146 000; Plein temps

Résumé du poste

GlobalFoundries seeks an experienced R&D engineer for the Advanced Packaging Lab to lead 3D-Heterogeneous Integration initiatives across multiple domains. You will drive BEOL process development, bonding, TSVs, and wafer-level packaging while partnering with engineers, vendors, and OSATs to enable new capabilities and rapid prototyping.

You will advance process integration, develop new materials and tooling expertise, perform data analysis, and troubleshoot integration challenges across

Qualifications

• MS degree with 4–5 years of related work experience.
• Deep knowledge of BEOL processes and integration (advanced bonding, TSVs).
• Experience with bump/wafer finish integration and wafer/probe tests.
• Collaboration with OSATs and experience in package development & assembly.
• Strong problem solving and DOE experience.

Responsabilités

• Lead 3D-HI process development for multi-die stacking and fine pitch bonding.
• Collaborate with unit process engineers, fabs, and vendors on tooling.
• Drive joint development projects for wafer-level 2.5D/3D integration.
• Plan end-to-end process integration and enable early prototyping.
• Develop expertise in processes, materials, and characterization resources.
• Analyze data, interpret results, and identify failure modes; resolve issues.

Connaissances

BEOL processes & integration

advanced bonding

TSVs

bump/wafer finish integration

wafer test/probe

OSAT collaboration

package development & assembly

design of experiments

troubleshooting

Formation

Master’s degree in Electrical Engineering

Master’s degree in Mechanical Engineering

Master’s degree in Chemical Engineering

Master’s degree in Materials Science

Description du poste

About GlobalFoundries:GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.Summary of Role:GlobalFoundries is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains.Essential Responsibilities:Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g. , multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.Drive data analysis, interpretation of results, and understanding of failure modes.Identify and resolve process integration issues and related challenges.Generate IP related to novel wafer integration and packaging technology.Other Responsibilities:Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.Participate in hiring activities.Mentor and guide new hires to assume their roles and responsibilities.Other duties as assigned by manager.Required Qualifications:Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.MS degree with at least 4~5 years of prior related work experience.In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.Strong problem solving and technical trouble shooting skills including expertise in design of experiment.Must have at least an overall 3.0 GPA and proven good academic standing.Language Fluency - English (Written & Verbal).Travel - Up to 10%.Preferred Qualifications:Education – PhD education level preferred with at least 2~3 years of prior related work experience.Demonstrated prior leadership experience internally or with an OSAT eco-system.Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.Strong written and verbal communication skills.Strong planning and organizational skills.Expected Salary Range$85,000.00 - $146,000.00The exact Salary will be determined based on qualifications, experience and location.If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law