Planar Nodes, Experienced Process Integration Engineer

Samsung; Austin (TX); On-site; USD 95,000 - 120,000; Full time

Job summary

Samsung Austin Semiconductor is seeking a product engineering professional to drive new product introductions and optimize yield across wafer sort and test data. You will translate design with fab process flows, collaborate with cross-functional teams, and address customer quality feedback to ensure on-time qualification and robust device performance.

The role emphasizes data mining, yield analysis, and NPI activities within a fast-paced semiconductor manufacturing environment in Austin, TX,

Qualifications

• Strong data analysis and yield optimization skills.
• Experience with wafer sort data, E-test and SPC/FDC.
• Proficiency in data mining and statistics.
• Experience in NPI and technology qualification.
• Cross-functional collaboration across Design, Foundry, Test, and Quality.

Responsibilities

• Collaborate with Process, DFM, Test, Device, Mfg, and Customer to ensure manufacturability and analyze data to translate wafer-sort results into actions.
• Provide comprehensive silicon analysis from data sources to model yield and understand process controls.
• Identify trends, devise mitigation strategies, and resolve yield and defect challenges.
• Monitor mass-production performance and drive yield to entitlement targets; improve detection and control processes.
• Create and present professional presentations to executive and customer meetings.
• Support various fab initiatives, including cost reduction, throughput and quality improvements.

Skills

Data analysis

Data mining

Yield analysis

Process flow

NPI & qualification

Cross-functional collaboration

Scripting: Python/C/Java

Tools

Layout viewers

DRC review

Job description

About Samsung Austin SemiconductorSamsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Come innovate with us!

Position Summary

Samsung Foundry PIE team serves as the primary product owners who demonstrate total ownership from first silicon fab-in to final package. All roads lead back to product owners who connect design with fab process flows to achieve end customer product satisfaction.

Drive new product introductions by checking margin of customer sample lots and corner lots, verifying new IP, and ensuring successful / on time product qualification.

Implement CIP developed BKMs to drive work class yield and device performance.

Resolve integration issues across wide range of product offerings that can have unique process margin weaknesses.

Manage change points as key stakeholders in review board process to minimize risk and ensure successful implementation to achieve intended improvements.

Urgently address customer quality feedback and claims to ensure a thorough resolution that builds customer confidence in Samsung Austin Semiconductor as the right business partner.

Support development of yield learning models based on wafer sort or final test data to define root causes and institute countermeasures.

Through these activities, Samsung Foundry Product Engineering targets robust yield, high quality, and efficient test operations are in place for Samsung's advanced process technologies and its customers.

Role and Responsibilities

Here's What You'll Be Responsible For:

• Closely collaborate with teams: Process, DFM, Test, Device, Module QnR, Mfg and Customer to ensure manufacturability of Samsung's products and rigorously analyze EDS/ET and process‑parameter data to translate wafer‑sort test results into actions to segregate EDS‑related anomalies from process related yield degradations
• Provide comprehensive silicon analysis from full array of data sources to model yield by driving strong characterization of process variations that demonstrate a high level understanding of key and critical controls necessary to achieve world class performance and yield.
• Identify trends, devise innovative mitigation strategies, and resolve complex yield and defect challenges by leveraging high‑volume production data
• Monitor mass‑production performance, collaborate with fab engineering to root‑cause systematic issues, address processing abnormalities and drive yield to entitlement targets. Continuously develop defense lines to improve detection and process controls to reduce risks and maximize production efficiency.
• Create and present professional presentations to share at executive and customer meetings.
• Show flexibility to support a variety of fab initiatives (cost reduction, throughput, quality, work and process efficiency).

Skills and Qualifications

Here’s what you’ll need:

• Core Technical & Data Analysis Skills to identify CIP yield up activities/plans and root cause of abnormal events
• Data Mining: Extensive experience in data mining and statistical analysis using variety of data sources.
• Data Correlation & Yield Analysis: Proficient in mapping wafer sort bin and parametric data back to fab electrical test (E-test/WAT) results and in‑line SPC / FDC data to identify contributing factors to variations.
• Utilize Advanced Diagnostics to drive failure mode realization - skilled in utilizing layout viewers and knowledge of DRC review. Understands different failure analysis and metrology techniques for developing data collection plans.
• New Product Introduction (NPI) & Technology Qualification – NPI & Technology Development to Mass Production: Proven track record of participating in new product introduction (NPI) and advanced semiconductor technology node bring-up and qualification phases.
• Process Flow Management: In-depth understanding and hands‑on experience with setting up process flows and process targets.
• Customer Engagement: Work with customers at kick off, validate CS lots, evaluate margin of Corner wafers, and support successful qualification with fab engineering representatives.
• Semiconductor Manufacturing: Fab Process & E-Test Knowledge – Solid foundational understanding of semiconductor fabrication processes and their direct impact on electrical performance and device characteristics.
• Professional & Soft Skills: Cross-Functional Collaboration – A proactive team member who collaborates seamlessly across cross‑functional engineering teams (Design, Foundry, Test, Customer, and Quality) to achieve yield target and qualification milestones.
• Scripting & Automation: Ability to develop, modify, or maintain automation scripts and data analysis tools using Python,C, or Java (highly advantageous).

The current base salary range for this role is between $95,000 - $120,000. Individual base pay rates will depend on factors