PIC Architect

Index Search; United States; On-site; USD 150,000 - 230,000; Full time

Job summary

Index Search seeks a Senior or Principal PIC Architect to lead photonic integrated circuit design for AI/data center, LiDAR, optical computing, and sensing applications. You will translate customer requirements into PIC architectures and guide products from concept through production.

The role is highly technical and customer-facing, requiring deep expertise in PIC design, layout, simulation, and integration with electronics and packaging. Strong communication and leadership are essential.

Qualifications

• 5+ years in photonic integrated circuit design/architecture.
• Experience with lasers, modulators, detectors, and optical coupling.
• Ability to translate customer requirements into PIC solutions.

Responsibilities

• Lead definition, architecture, design, simulation, layout, and testing of PICs.
• Collaborate with customers to translate requirements into technical PIC solutions.
• Conduct feasibility studies and define program requirements, timelines, and deliverables.
• Design and model custom PICs using commercial/internal tools.
• Coordinate packaging, chip interfaces, and fabrication requirements.
• Define test requirements and analyze technical data.
• Lead on customer programs and transition products to production.

Skills

PIC design

Layout & simulation

Customer-facing

Cross-functional communication

Education

Electrical Engineering or related field

Tools

Commercial PIC design tools

Job description

We are seeking a Senior or Principal PIC Architect to join a growing engineering organization developing next-generation photonic integrated circuits for applications including AI/data center communications, LiDAR, optical computing, and advanced sensing.

This is a highly technical, customer-facing role for someone with strong experience in photonic integrated circuit design and architecture. You will play a critical role in translating customer requirements into PIC designs and helping move products from concept and development through production.

What You'll Do

• Lead the definition, architecture, design, simulation, layout, and testing of photonic integrated circuits.
• Work directly with customers to understand product requirements and translate them into technical PIC solutions.
• Conduct feasibility studies and help establish program requirements, timelines, and deliverables.
• Design and model custom PICs using commercial and internally developed tools.
• Work cross-functionally with component design, layout, packaging, process, test, and reliability engineering teams.
• Coordinate packaging, chip interfaces, and fabrication requirements.
• Define test requirements, review test plans, and analyze technical data.
• Help identify and prioritize new photonic components for the PDK roadmap.
• Serve as a technical lead across customer programs and help transition products from development into production.

What We're Looking For

• 5+ years of relevant industry experience; 10+ years of combined professional and advanced research experience preferred.
• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Applied Physics, Applied Materials Science, or a related technical discipline.
• Strong experience with PIC design and architecture, including layout and simulation.
• Deep understanding of photonic components such as lasers, modulators, amplifiers, detectors, passives, and optical coupling.
• Experience understanding how PICs integrate into larger optical systems, electronics, sub-assemblies, and modules.
• Experience within datacom, LiDAR, optical circuit switching (OCS), data center applications, or similar optical technologies.
• Ability to work directly with customers, understand technical requirements, and serve as a technical lead on complex programs.
• Understanding of manufacturing challenges and transitioning products from development into production.
• Strong communication, problem-solving, organizational, and presentation skills.

Experience with high-speed optical testing and photonic packaging is preferred.