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MIT Lincoln Laboratory is seeking a Photonics Test Engineer to perform wafer-level and chip-scale measurements on photonic integrated circuits and to develop custom test systems for characterizing PICs. You will operate optical probe stations, fiber-optic assemblies, and test instrumentation to characterize devices at wafer, chip, and package levels.
The role emphasizes setting up automated test routines, expert PIC measurement techniques, data processing, and collaboration with design,
Date: Jul 8, 2026
Location: Lexington, MA, US
Company: MIT Lincoln Laboratory
The RF and Integrated Photonics Group (Group 85) is committed to advancing technologies in the national interest by harnessing novel RF and photonic capabilities. The group's work encompasses everything from foundational research into materials and components to the development of complete RF and photonics systems. Key application areas include classical and quantum sensing and computing systems, as well as laser, radar, communications, and electronic warfare technologies.
The integrated photonics area focuses on developing photonic integrated circuits (PICs) and active photonic devices for classical and quantum applications including microwave photonics; ion trap quantum computing; quantum sensing and communication; advanced laser, modulator, photodetector and other device development; and non‑linear photonic applications.
The group seeks a highly motivated, detail‑oriented, curious, and driven scientist or engineer to join our integrated photonics testing team. The successful candidate will join a close‑knit, dynamic team working at the forefront of photonic integrated circuit (PIC) platform and systems development.
In this role, the successful candidate will perform wafer‑level and chip‑scale measurements on photonic integrated circuits and develop custom test systems for characterizing unique PIC chips and subsystems. They will operate and maintain photonic test setups using optical probe stations, fiber‑optic assemblies, and optical or electro‑optical test instrumentation to characterize devices and subsystems at the wafer, chip, and package levels.
Responsibilities include constructing testbeds, performing measurements, collecting and analyzing data, troubleshooting device behavior, and collaborating closely with design, fabrication, and systems teams to enhance device performance, yield, and test repeatability.
A key aspect of this role is supporting both manual probe station work and automated wafer‑level testing. The successful candidate will set up, run, and maintain automated test routines and will become an expert in PIC measurement techniques, test automation, and data processing. This is an excellent opportunity for an engineer who enjoys a combination of hands‑on lab work, problem‑solving, and software‑enabled test automation in a fast‑paced photonics environment.
Recent Graduate Hiring Range: $100,200-$120,000
Experienced Hiring Range: $100,200-$150,000
Selected candidate will be subject to a pre‑employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.