Photonic Test and Packaging Engineer

Lightwave Logic, Inc.; Englewood (CO); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Stock options

Medical, dental, vision insurance (em/

PTO policy

401K match

Job summary

Lightwave Logic, Inc. in Englewood, CO, seeks a detail-oriented Photonic Test and Packaging Engineer to support opto‑electronic device characterization, prototyping, packaging, and reliability efforts in a hands‑on lab environment.

The ideal candidate will have a MS/PhD in a related field, 1–3 years of lab experience, strong Python skills, and experience with wafer probing and data analysis to drive device yield.

Qualifications

• MS or PhD in Electrical or Mechanical Engineering, Optics, Photonics, or related field.
• 1–3 years hands-on experience in an optics or semiconductor laboratory.
• Strong fundamental understanding of fiber optics, waveguides, and optical alignment.
• Experience handling single‑mode fibers and optical components.
• Proficiency in Python, familiarity with PyVISA, Pandas, or Matplotlib.
• Familiarity with Tunable Lasers, Optical Power Meters, Source Measure Units (SMUs), and Oscilloscopes.
• Ability to carefully follow precise recipes and document experimental conditions rigorously.
• Ability to present scientific results clearly by highlighting relevant takeaways and using effective data plotting.

Responsibilities

• Execute precision optical alignment and manual landing of probes on semiconductor dies to test the performance of photonic devices.
• Collect, analyze, and report data on device metrics such as Insertion Loss, Vπ, Extinction Ratio, RF, and EO bandwidth, etc.
• Use Python code to perform automated measurements and make modifications to acquisition code and photonic setup when required.
• Assist in performing electro‑optical characterization of thin film samples (including Teng‑Man and other optical measurements) following established protocols.
• Assist in reliability study schedules: loading and unloading samples from aging chambers and performing measurements at critical times.
• Perform the poling procedure on electro‑optic polymer devices. This involves applying DC fields across the device while managing thermal profiles to align chromophores in the polymer.
• Monitor leakage currents and probe contact during the poling process to ensure device yield.
• Conduct prototype packaging operations to transition devices from bare die to testable modules.
• Perform and optimize die‑attach, wire bonding, and fiber array attach.
• Develop and maintain Python scripts to automate instrument control (lasers, source measure units, optical power meters).
• Process large datasets to extract statistical trends regarding device performance and yield.
• Other duties and projects as assigned.

Skills

Python

Wafer probing

Optical alignment

Single-mode fibers

Data analysis

Oscilloscopes

SMUs

Probe landing

Education

MS or PhD in Electrical/Optics/Photonics

Tools

PyVISA

Pandas

Matplotlib

LabVIEW

Job description

Lightwave Logic (Nasdaq: LWLG) is a publicly traded materials development company that is conducting cutting‑edge work to commercialize its proprietary organic nonlinear polymers for a variety of electro‑optic devices and pushing the state of the art in high‑speed fiber‑optic telecom and data communications. Our development roadmap is designed to disrupt the industry by introducing organic modulators and related photonic integrated circuits that offer superior speed, lower power consumption, and smaller size compared to current technologies. Our materials are extendable into other applications, including sensors and quantum computing.

Job Description

We are seeking a detail‑oriented Photonic Test and Packaging Engineer to support our opto‑electronic device characterization, prototyping, packaging, and device reliability efforts. The ideal candidate is a hands‑on experimentalist who is comfortable working in an optics/semiconductor lab environment. They are responsible for the testing of optical modulators, including poling electro‑optic polymers, testing of photonic devices and thin film polymer samples, in‑house packaging, and characterization data analysis. This role requires a blend of delicate manual dexterity for probing and packaging, software skills for automating measurements and organizing data, and engineering prowess for experimental problem‑solving and interpretation of data.

Responsibilities

• Execute precision optical alignment and manual landing of probes on semiconductor dies to test the performance of photonic devices.
• Collect, analyze, and report data on device metrics such as Insertion Loss, Vπ, Extinction Ratio, RF, and EO bandwidth, etc.
• Use Python code to perform automated measurements and make modifications to acquisition code and photonic setup when required.
• Assist in performing electro‑optical characterization of thin film samples (including Teng‑Man and other optical measurements) following established protocols.
• Assist in reliability study schedules: loading and unloading samples from aging chambers and performing measurements at critical times.
• Perform the poling procedure on electro‑optic polymer devices. This involves applying DC fields across the device while managing thermal profiles to align chromophores in the polymer.
• Monitor leakage currents and probe contact during the poling process to ensure device yield.
• Conduct prototype packaging operations to transition devices from bare die to testable modules.
• Perform and optimize die‑attach, wire bonding, and fiber array attach.
• Develop and maintain Python scripts to automate instrument control (lasers, source measure units, optical power meters).
• Process large datasets to extract statistical trends regarding device performance and yield.
• Other duties and projects as assigned.

Qualifications

• M.S. or Ph.D. in Electrical or Mechanical Engineering, Optics, Photonics, Physics, or a related field.
• 1–3 years of hands‑on experience in an optics or semiconductor laboratory.
• Strong fundamental understanding of fiber optics, waveguides, and optical alignment.
• Experience handling single‑mode fibers and optical components.
• Demonstrated ability to manipulate wafer probe stations and successfully land probes on small pads without causing damage.
• Proficiency in Python, familiarity with libraries such as PyVISA, Pandas, or Matplotlib.
• Familiarity with Tunable Lasers, Optical Power Meters, Source Measure Units (SMUs), and Oscilloscopes.
• Ability to carefully follow precise recipes and document experimental conditions rigorously.
• Ability to present scientific results clearly by highlighting relevant takeaways and using effective data plotting.

Preferred Skills

• Understanding of electro‑optic polymer physics.
• Experience with designing and modifying photonic test setups.
• Experience with wedge wire bonding.
• Proficiency in JMP, COMSOL, Lumerical, Labview, or HFSS.

LightwaveLogic offers a highly competitive compensation package including stock options, as well as comprehensive benefits including fully paid medical, dental, and vision insurance coverage (employee and family), a generous PTO policy, $500/year (prorated) company contribution to your medical FSA, and a 401K (Safe Harbor, 4 % match).

EEO Statement

Lightwave Logic is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.