Photolithography Equipment Engineer

NXP Semiconductors NV; Chandler (AZ); On-site; USD 95,000 - 130,000; Full time

Job summary

NXP Semiconductors in Chandler, AZ seeks a Photolithography Equipment Engineer for a high-volume wafer fabrication environment. Requires experience with ASML PAS5500/400/700 scanners and other lithography tools; BS/MS in engineering and 5+ years of process engineering in semiconductor manufacturing are required.

Includes responsibilities for reducing machine faults, implementing root-cause action plans, and training maintenance staff while improving equipment costs and scrap rates.

Qualifications

• Must have a BS or MS degree in engineering or a degree in a relevant field of studies.
• More than 5 years of process engineering experience in a similar high-volume semiconductor manufacturing environment.

Responsibilities

• Identify and reduce recurring machine faults.
• Create hard down action plans driving to root cause.
• Develop and improve tool maintenance procedures.
• Train maintenance technicians.
• Reduce overall cost of equipment and scrap.
• Improve tool utilization and availability.
• Participate in cross-functional and lean activity teams.
• Support process development activities.
• Source and release new equipment.
• Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs.

Skills

Root cause analysis

Process improvement

Lean methods

Training

Education

BS or MS in engineering

Tools

ASML Scanner PAS5500/400/700

Canon Stepper

TEL ACT 8/Mark 7 track

KLA 8100 CDSEM

KLA SL3/Archers/UVs/ASET/HRPs

Onto IRIS

Job description

Business Line Description

NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.

Job Summary

Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.

Key Challenges

• Identification and reduction of reoccuring machine faults
• Creation of hard down action plans driving to root cause
• Developing and improving tool maintenance procedures
• Training maintenance technicians
• Reducing overall cost of equipment and scrap
• Improving tool utilization and availability
• Participating in and/or leading cross-functional and lean activity teams
• Supporting process development activities
• Sourcing and releasing new equipment
• Training maintenance technicians
• Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs

Cross Functional Aspects

• Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process

Job Qualifications

• Must have a BS or MS degree in engineering or a degree in relevant field of studies
• More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.