PCB Rework Technician

Etched; San Jose (CA); On-site; USD 80,000 - 100,000; Full time

Benefits offered by this job

Medical, dental, and vision packages

$500/month credit for waiving medical benefits

Housing subsidy of $2k per month

Relocation support

Daily lunch and dinner in the office

Job summary

A leading tech company in San Jose is seeking a skilled PCB Rework Technician to support engineering efforts through high-reliability rework processes. Responsibilities include performing precision rework on large BGAs and complex repairs on advanced PCBs. The ideal candidate has over five years of experience, strong manual dexterity, and a detailed knowledge of IPC standards. Competitive benefits, including housing subsidies and wellness programs, are offered.

Qualifications

• 5+ years of hands-on PCB rework experience on production-quality and/or R&D hardware.
• Proven expertise with large BGAs (> 70 mm) and fine-pitch components.
• Familiarity with IPC-A-610 and IPC-7711/21 workmanship standards.

Responsibilities

• Perform precision rework and re-balling of very-large BGAs with high first-pass yield.
• Operate large-format BGA rework systems with exact alignment.
• Inspect reworked assemblies with X-ray or AOI equipment.

Skills

Precision rework

Attention to detail

Manual dexterity

Visual-inspection skills

Tools

Hot-air/IR rework platforms

X-ray or AOI systems

Job description

About Etched

Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) only supports transformers, but has an order of magnitude more throughput and lower latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents.

Job Summary

We are seeking a highly skilled PCB Rework Technician with advanced capabilities in large BGA rework (including components >70mm) and complex board-level repairs involving fine-pitch components down to 0402. This role is critical to supporting engineering, validation, and bring-up efforts by performing high-reliability rework on advanced PCBs, including those supporting custom ASICs.

Key Responsibilities

• Perform precision rework and re-balling of very-large BGAs (custom ASIC packages > 70 mm) with high first-pass yield.

• Operate large-format BGA rework systems, ensuring exact alignment, controlled thermal profiles, and clean re-flow on high-pin-count ICs.

• Rework SMT and through-hole components down to 0402 packages, maintaining exceptional workmanship and consistency across boards.

• Read and interpret ECNs, schematics, layout files, and BOMs to execute component swaps and design modifications accurately.

• Execute advanced board-level repairs: trace cuts, jumper-wire additions, micro-soldering, and circuit rerouting.

• Inspect reworked assemblies with X-ray or AOI equipment to verify solder-joint integrity, alignment, and overall quality.

• Maintain detailed rework documentation and clearly communicate findings or improvement ideas to engineers.

• Collaborate closely with hardware, validation, and bring-up teams to support rapid iteration and tight project timelines.

You may be a good fit if you have

• 5 + years of hands-on PCB rework experience on production-quality and/or R&D hardware.

• Proven expertise with large BGAs (> 70 mm), fine-pitch QFNs/BGAs, and 0402-scale components.

• Proficiency using advanced hot-air/IR rework platforms, precision microscopes, and large-area heaters designed for custom ASICs or high-power devices.

• Skill in following detailed engineering rework instructions, layout files, and schematics with minimal supervision.

• Familiarity with IPC-A-610 and IPC-7711/21 workmanship and rework standards.

• Exceptional attention to detail, steady manual dexterity, and strong visual-inspection skills.

• Comfort working in a fast-paced, evolving R&D environment where requirements can change quickly.

Strong candidates may also have experience with

• Operating and programming X-ray or AOI systems for real-time inspection and failure analysis.

• Performing micro-soldering, trace repair, and circuit rerouting on high-density, multi-layer boards.

• Reballing custom ASIC packages and handling ultra-large, high-pin-count ICs.

• Developing or optimizing thermal profiles for challenging package types (e.g., stacked dies, high-power BGAs).

• Documenting rework processes in MES/PLM systems and feeding back design-for-rework (DFR) recommendations.

• Supporting engineering bring-up with rapid component swaps, blue-wire fixes, and on-the-fly design experiments.

Benefits

• Medical, dental, and vision packages with generous premium coverage

  • $500 per month credit for waiving medical benefits

• Housing subsidy of $2k per month for those living within walking distance of the office

• Relocation support for those moving to San Jose (Santana Row)

• Various wellness benefits covering fitness, mental health, and more

• Daily lunch and dinner in our office