Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging (AWS)

Amazon; Tempe (AZ); On-site; USD 136,000 - 184,000; Full time

Benefits offered by this job

Health insurance

RSUs

401(k) matching

Paid time off

Parental leave

Job summary

Amazon Annapurna Labs in Tempe, AZ is seeking an experienced IC packaging engineer to execute die floor planning, RDL routing, and tape-out readiness for advanced packaging. You will collaborate with ASIC teams, OSAT partners, and SI/PI to optimize die-to-package interfaces and ensure DFM-compliant designs.

Ideal candidates have 5+ years in IC package layout, hands-on experience with Cadence/SiP tooling, and familiarity with 2.5D/3D-IC, RDL, and interposer technologies.

Qualifications

• Bachelor's degree in Electrical Engineering or related field required.
• 5+ years in IC package layout and physical design.
• Experience with multi-layer substrates or interposers.

Responsibilities

• Execute package layout tasks across design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
• Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out WLP, and silicon bridge technologies.
• Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
• Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias.
• Support die-level RDL routing and bump planning with ASIC teams to co-optimize die-package interface.
• Cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under senior guidance.
• Maintain package stack-up definitions with SI/PI and materials teams.
• Run DRC, connectivity checks, and support design closure.
• Follow package design rules and work with OSATs to ensure DFM compliance.
• Collaborate with SI/PI to incorporate electrical constraints into layout (impedance, PDN, shielding).

Skills

IC package layout

Physical design

RDL routing

2.5D/3D-IC

DFM constraints

Cross-functional collaboration

Verifications (DRC)

Cadence/SiP tools

Silicon interposer

Impedance control

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Communications Engineering

Tools

Cadence APD/SiP

Synopsys IC Packaging

Mentor Xpedition

Job description

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

Key job responsibilities

• - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
• - Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan‑out wafer‑level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
• - Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
• - Perform RDL and substrate routing for high‑density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi‑layer organic substrates or silicon interposers.
• - Support die‑level RDL routing and bump planning in coordination with ASIC physical design teams to help co‑optimize the die‑package interface.
• - Contribute to cross‑level layout co‑optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
• - Assist in maintaining package stack‑up definitions in collaboration with SI/PI and materials engineering teams.
• - Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
• - Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
• - Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance‑controlled routing, power plane optimization, and critical net shielding.

Basic Qualifications

• - Bachelor's degree in Electrical Engineering or a related field
• - Experience identifying bugs in architecture, algorithms, functionality, and performance with strong overall debugging skills
• - Experience verifying at multiple levels of logic from IP blocks to SoCs to full system testing
• - 5+ years of experience in IC package layout and physical design
• - Experience executing package designs from concept through tape out for multi‑layer organic substrates or silicon interposers
• - Hands‑on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
• - Understanding of advanced packaging technologies: 2.5D/3D‑IC, fan‑out WLP, RDL, TSV, microbump, or silicon bridge interconnects
• - Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks)
• - Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design
• - Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams

Preferred Qualifications

• - Master's degree in Electrical or Communications Engineering or a related field
• - Experience with formal verification techniques including abstraction and end‑to‑end checking
• - Experience with ARM and various DSP ISAs
• - Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards
• - Experience with industry standard tools and scripting languages (Python or Perl) for automation
• - MS with 3+ years in IC package layout and physical design
• - Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions
• - Exposure to chiplet‑based or heterogeneous integration packaging architectures
• - Familiarity with package‑level SI/PI concepts (impedance control, PDN layout, crosstalk‑aware routing) sufficient to collaborate with SI/PI engineers
• - Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks
• - Exposure to working with OSAT partners on NPI builds or yield improvement efforts
• - Familiarity with high‑bandwidth memory (HBM) integration in advanced packaging contexts

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits .

USA, AZ, Tempe - 136,000.00 - 184,000.00 USD annually USA, CA, Cupertino - 157,300.00 - 212,800.00 USD annually USA, TX, Austin - 136,000.00 - 184,000.00 USD annually

Posted: July 5, 2026 (Updated 20 days ago)

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