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KLA Milpitas is seeking a candidate to design and prototype the next generation broadband plasma wafer inspection systems within the Broadband Plasma Division (BBP). You will collaborate with suppliers and cross-functional teams to define subsystem requirements and oversee design reviews throughout development.
You will engage in CAD modeling, precision mechanism development, and CAE simulations (thermal, structural, flow) to qualify and release designs for manufacturing.
KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us.
With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.
Doctorate (Academic) or work experience of 0 years , Master's Level Degree or work experience of 2 years , Bachelor's Level Degree or work experience of 3 yearsBase Pay Range: $117,800.00 - $200,300.00 AnnuallyPrimary Location: USA-CA-Milpitas-KLAKLA's total rewards package for employees may also include participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave.
KLA is proud to be an Equal Opportunity Employer. We will ensure that qualified individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. Please contact us at talent.acquisition@kla.com or at +1-408-352-2808 to request accommodation.