Optical Module Layout Engineer

Supermicro

San Jose (CA)

On-site

USD 138,000 - 160,000

Full time

43 hours ago
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Job summary

Supermicro is seeking a highly motivated Optical Module Layout Engineer to join our Optical Engineering team. The successful candidate will be responsible for the physical design and PCB layout of high-speed optical transceiver modules used in AI, Cloud, Data Center, and HPC applications.

This role requires close collaboration with electrical, mechanical, optical, manufacturing, and supplier engineering teams to develop next-generation 800G and 1.6T optical modules.

Qualifications

  • Bachelor's degree in Electrical Engineering, Electronics Engineering, Physics, Optics, or related field.
  • 5+ years of PCB layout experience in optical transceiver products.
  • Experience with optical module design including QSFP28, QSFP-DD, OSFP, CFP, or coherent optical modules.
  • Multilayer PCB design with high-speed serial interfaces.

Responsibilities

  • Develop PCB layouts for high-speed optical transceiver products including QSFP, QSFP-DD, OSFP, and future optical module form factors.
  • Perform component placement optimization considering signal integrity, power integrity, thermal performance, manufacturability, and reliability requirements.
  • Collaborate with electrical and signal integrity engineers to implement high-speed differential routing for channels operating at 112G, and 224G PAM4.
  • Work closely with optical, mechanical, and packaging engineers to ensure successful integration of lasers, photodiodes, DSPs, TIAs, drivers, and optical engines.
  • Create and maintain layout guidelines, stack-up definitions, design rules, and best practices.
  • Conduct signal integrity and power integrity reviews utilizing simulation tools and design analysis methodologies.
  • Support DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Test) activities.
  • Participate in prototype bring-up, debugging, qualification, and root-cause analysis.
  • Interface with PCB fabricators, assembly vendors, and component suppliers to resolve design and manufacturing issues.
  • Support NPI (New Product Introduction) and product lifecycle management activities.
  • Ensure compliance with industry standards and customer requirements.

Skills

PCB Layout
Signal Integrity
Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering, Electronics Engineering, Physics, Optics, or related technical discipline
Master's degree preferred

Tools

Cadence Allegro

Job description

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Location: San Jose, California, United States

About Supermicro:

Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are the #5 fastest growing company among the Silicon Valley Top 50 technology firms. Our unprecedented global expansion has provided us with the opportunity to offer a large number of new positions to the technology community. We seek talented, passionate, and committed engineers, technologists, and business leaders to join us.

Job Summary:

We are seeking a highly motivated Optical Module Layout Engineer to join our Optical Engineering team. The successful candidate will be responsible for the physical design, PCB layout of high-speed optical transceiver modules used in AI, Cloud, Data Center, and High-Performance Computing (HPC) applications. This role requires close collaboration with electrical, mechanical, optical, manufacturing, and supplier engineering teams to develop next-generation 800G and 1.6T optical modules.

Essential Duties and Responsibilities:
  • Develop PCB layouts for high-speed optical transceiver products including QSFP, QSFP-DD, OSFP, and future optical module form factors.
  • Perform component placement optimization considering signal integrity, power integrity, thermal performance, manufacturability, and reliability requirements.
  • Collaborate with electrical and signal integrity engineers to implement high-speed differential routing for channels operating at 112G, and 224G PAM4.
  • Work closely with optical, mechanical, and packaging engineers to ensure successful integration of lasers, photodiodes, DSPs, TIAs, drivers, and optical engines.
  • Create and maintain layout guidelines, stack-up definitions, design rules, and best practices.
  • Conduct signal integrity and power integrity reviews utilizing simulation tools and design analysis methodologies.
  • Support DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Test) activities.
  • Participate in prototype bring-up, debugging, qualification, and root-cause analysis.
  • Interface with PCB fabricators, assembly vendors, and component suppliers to resolve design and manufacturing issues.
  • Support NPI (New Product Introduction) and product lifecycle management activities.
  • Ensure compliance with industry standards and customer requirements.
Qualifications:

Education

  • Bachelor's degree in Electrical Engineering, Electronics Engineering, Physics, Optics, or related technical discipline.
  • Master's degree preferred.

Experience

  • 5+ years of PCB layout experience in optical transceiver products.
  • Experience with optical module design including QSFP28, QSFP-DD, OSFP, CFP, or coherent optical modules.
  • Proven experience designing multilayer PCBs with high-speed serial interfaces.

Technical Skills

  • Expert knowledge of PCB layout tools such as:
  • Cadence Allegro
  • Strong understanding of:
  • Signal Integrity (SI)
  • Power Integrity (PI)
  • Electromagnetic Compatibility (EMC)
  • Experience routing:
  • Ethernet 100G/200G/400G/800G
  • PAM4 SerDes technologies
  • Understanding of:
  • Optical subassemblies
  • TIAs
  • Optical packaging technologies
  • Power Modules
  • Familiarity with:
  • Mechanical integration constraints
  • Manufacturing processes

Preferred Qualifications

  • Experience with 400G, 800G, and 1.6T optical transceiver technologies.
  • Experience supporting AI/ML infrastructure or hyperscale data center products.
  • Knowledge of co-packaged optics (CPO) and linear pluggable optics (LPO).
  • Experience working with contract manufacturers and module assembly suppliers.
Salary Range

$138,000 - $160,000

The salary offered will depend on several factors, including your location, level, education, training, specific skills, years of experience, and comparison to other employees already in this role. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation, such as participation in bonus and equity award programs.

EEO Statement

Supermicro is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of Supermicro to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.

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