Next-Gen Hardware & Systems Developer Intern

IBM; Hopewell Junction (NY); Hybrid; USD 74,000 - 135,000; Full time

Job summary

IBM Hardware and Systems Developer Intern 2027 – New York is a hands-on internship in IBM's state‑of‑the‑art development labs. You will design, prototype, test, and refine hardware across mechanical, electrical, and optical domains, leveraging CAD, EDA, and scripting to accelerate validation.

You will collaborate across disciplines, participate in system bring-up, learn DOE practices, and contribute to reliability and materials development.

Qualifications

• High School Diploma or GED required; pursuing engineering degree preferred.
• B.S. or M.S. in Mechanical, Electrical, Materials, Chemical, Industrial or related Engineering.
• Comfort with CAD and simulation tools; programming for automation is a plus.

Responsibilities

• Collaborate across disciplines to design, model, and validate next-generation hardware.
• Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools.
• Participate in PCB layout, power and signal integrity, circuit design, and system bring-up.
• Conduct experiments, analyze data, and contribute to reliability, process and materials development.

Skills

Mechanical Eng

Electrical Eng

Materials Eng

Chemical Eng

Industrial Eng

Python

C/C++

Bash

CAD tools

Reliability

Education

High School Diploma/GED

Bachelor's Degree

Tools

SolidWorks

AutoCAD

Allegro

Cadence

CFD

FEM

HFSS

Job description

IBM Hardware and Systems Developer Intern 2027 – New York is a hands-on internship in IBM's state‑of‑the‑art development labs. You will design, prototype, test, and refine hardware across mechanical, electrical, and optical domains, leveraging CAD, EDA, and scripting to accelerate validation.

You will collaborate across disciplines, participate in system bring-up, learn DOE practices, and contribute to reliability and materials development.