MTS 3D Heterogenous Integration Engineer

Global Foundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.

You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential.

Qualifications

• MS/PhD in a relevant engineering field with strong academic performance (GPA 3.0+).
• Strong problem solving and troubleshooting skills including DOE capabilities.
• Fluency in English (written & verbal).
• Travel up to 20% for project collaboration and customer-facing activities.

Responsibilities

• Drive 3D-HI process development for advanced packaging building blocks.
• Address power density and thermal challenges at package level.
• Collaborate with unit process engineers, vendors, and fab teams.
• Lead joint development projects for 2.5D/3D HI processes.
• Drive end-to-end process integration and planning for prototyping.
• Develop expertise in materials, processes and tooling; optimize characterization resources.
• Analyze data, interpret results, and resolve integration issues; generate IP related to wafer integration.

Skills

Problem solving

DOE design of experiments

Team collaboration

Education

Master's in Electrical Engineering

PhD preferred in related field

Job description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development.

Essential Responsibilities:

• Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
• Drive thermal solution to address power density, hotspot mitigation, thermal spreading, and package-level heat removal challenges in next-generation semiconductor products.
• Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
• Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
• Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
• Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
• Drive data analysis, interpretation of results, and understanding of failure modes. Identify and resolve process integration issues and related challenges.
• Generate IP related to novel wafer integration and packaging technology.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Participate in hiring activities.
• Mentor and guide new hires to assume their roles and responsibilities.
• Other duties as assigned by manager.

Required Qualifications:

• Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 5-6 years of prior related work experience. In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly thermal management.
• Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 20%.

Preferred Qualifications:

• Education - PhD education level preferred with at least 3-4 years of prior related work experience.
• Demonstrated prior leadership experience internally or with an OSAT eco-system.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Expected Salary Range$98,000.00 - $176,000.00The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential.

GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people.

Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.