Module Product Engineer

Renesas Electronics Corporation; Tempe (AZ); Hybrid; USD 110,000 - 140,000; Full time

Job summary

Renesas Electronics Corporation is seeking an experienced Product Engineer to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from NPI through high-volume production and sustaining. You will oversee design, test, quality, assembly, and manufacturing to meet performance, quality, cost, and schedule targets.

The role requires 8+ years in semiconductor product/ manufacturing/ test engineering with NPI ownership, strong data analysis, and

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field; master's preferred.
• 8+ years in semiconductor product/manufacturing/test engineering with NPI ownership.
• Strong depth in semiconductor power products and module manufacturing.
• Data analysis skills to interpret statistics and drive decisions.
• Experience with DfX, qualification, and high-volume manufacturing transfer.
• Strong written and verbal communication with customers and cross-functional teams.
• Proven ability to lead complex technical decisions and escalations.

Responsibilities

• Own product engineering execution from NPI through high-volume production and sustaining.
• Own manufacturability and drive robust assembly processes across OSAT and internal sites.
• Enforce IPC-A‑610 assembly workmanship standards.
• Lead cross‑functional alignment across Design, Test, Quality, and Manufacturing.
• Resolve assembly excursions including die attach, clip attach, solder integrity, defects.

Skills

Semiconductor products

Data analysis

NPI through production

Cross‑functional leadership

Technical decision making

Education

Bachelor's degree in Electrical/Computer Engineering

Master's degree in a relevant engineering field preferred

Tools

IPC‑A‑610 knowledge

Job description

Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future.

Hybrid

Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale.

Key Responsibilities

• Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining.
• Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites.
• Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A‑610 (Acceptability of Electronic Assemblies).
• Drive cross‑functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high‑yield module production.
• Lead resolution of assembly‑related excursions, including die attach, clip attach, solder integrity, and module‑level defects.
• Lead product bring‑up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
• Define and maintain product specifications, limits, and guard‑bands based on silicon behavior and manufacturing capability.
• Lead yield analysis, parametric trend monitoring, and root‑cause investigations.
• Drive cost, yield, and cycle‑time improvement through data‑driven analysis.
• Own manufacturing release, qualification execution, and product change management (PCNs).
• Serve as the technical escalation owner for production issues, customer returns, and corrective actions.
• Support critical customer engagements on product, quality, and manufacturing topics as needed.
• 10% travel.

Qualifications

• Bachelor’s degree required in Electrical Engineering, Computer Engineering, or a related field; master’s degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.
• 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high‑volume production.
• Strong technical depth in semiconductor power products and advanced power module manufacturing.
• Strong data analysis skills with the ability to interpret statistical results and drive decisions.
• Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
• Strong written and verbal communication skills with customers and cross-functional teams.
• Proven ability to lead complex technical decisions, escalations, and execution across organizations.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.