Micro-Optics Engineer

Volantis Semiconductor, Inc.

Boston (MA)

On-site

USD 140,000 - 190,000

Full time

14 days+
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Job summary

Volantis Semiconductor, Inc. is seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens arrays for high-density photonic packages.

You will translate system requirements into manufacturable designs and build tolerance budgets across fabrication, placement, and packaging. The role emphasizes cross-functional collaboration with lithography, deposition, and metrology teams, along with prototype characterization and data-driven design iteration.

Qualifications

  • MS/PhD in Optical Engineering, Electrical Engineering, Applied Physics, Physics, Photonics, Mechanical Engineering, Materials Science, or related field; BS with exceptional experience considered.
  • Experience in micro-optics, wafer-level optics, optical design, photonic packaging, or semiconductor process integration.
  • Designing microlens arrays or micro-optical surfaces within manufacturing constraints.
  • Proficiency with optical modeling and tolerancing in Zemax, Code V, FRED, LightTools, VirtualLab, COMSOL.
  • Nice to have: FDTD-Zemax co-design or EM-to-system modeling.
  • Nice to have: semiconductor processing knowledge or DFM aspects.

Responsibilities

  • Own micro-optical design, including lens pitch, focal length, NA, sag, and coating choices.
  • Build connected optical models with multiple tools, merging ray and physical optics.
  • Bridge EM-scale and package-scale design with simulations for system trade studies.
  • Drive tolerancing and yield with Monte Carlo and DOE methods.
  • Collaborate with lithography, imprinting, deposition, and metrology teams.
  • Translate design intent into vendor specs, prescriptions, and inspection criteria.
  • Validate hardware with prototype characterization and environmental tests.
  • Automate simulations and data reporting with Python.

Skills

Microlens design
Optical modeling
Python automation
Tolerance analysis
EM/optical co-design
Zemax OpticStudio
Code V / FDTD
Statistical methods

Education

MS or PhD in Optical/Electrical/Physics
Industry experience in micro-optics or photonics

Tools

Zemax OpticStudio
Code V
FRED
LightTools
COMSOL

Job description

Role Overview

We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical requirements into manufacturable designs, build tolerance budgets, work with fabrication and packaging partners, and close the loop with measured data.

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Candidate note: We do not expect one person to match every item below. Strong candidates from micro-optics, optical packaging, semiconductor photonics, lithography/process integration, precision optics, or FDTD-Zemax co-design backgrounds are encouraged.

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What You Will Do
  • Own micro-optical design: design microlens arrays and compact micro-optical components, including lens pitch, aperture, focal length, numerical aperture, sag, surface form, fill factor, array uniformity, substrate, material, and coating choices.
  • Build connected optical models: use tools such as Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent; combine ray, physical-optics, diffraction, and statistical methods where appropriate.
  • Bridge EM-scale and package-scale design: where useful, connect FDTD, FEM, EME, RCWA, or similar electromagnetic simulations to Zemax/Code V/physical-optics models so local optical-interface behavior is represented in system-level trade studies.
  • Drive tolerancing and yield: develop sensitivity studies and tolerance budgets across fabrication, placement, package stack-up, adhesive, thermal, refractive-index, coating, and surface-form variation; use Monte Carlo and DOE methods to connect design choices to expected yield.
  • Bring semiconductor process awareness: partner with process and supplier teams across lithography, grayscale/direct-write patterning, imprint, etch transfer, deposition, thin-film coatings, wafer-level metrology, design rules, and process-window trade-offs.
  • Translate design intent: create vendor-ready specifications, optical prescriptions, mechanical drawings and guidance, material and coating requirements, metrology plans, incoming inspection criteria, and acceptance criteria.
  • Partner with suppliers: evaluate fabrication routes such as photoresist reflow, grayscale lithography, etch transfer, molding, and replication.
  • Validate hardware: plan and run prototype characterization, including surface profile, focal length, array uniformity, optical throughput, reflection behavior, polarization sensitivity, thermal drift, environmental stability, and alignment sensitivity.
  • Automate the workflow: build Python tools for simulation sweeps, tolerance studies, data reduction, visualization, dashboards, and clear technical reporting.
  • Work cross-functionally: partner with packaging, mechanical, thermal, test, reliability, device, and system teams to move designs from concept to qualified hardware.
What Will Help You Succeed

This section is a guide, not a rigid checklist. We care most about evidence of technical ownership, sound physics, manufacturability judgment, and the ability to learn quickly.

  • M.S. or Ph.D. in Optical Engineering, Electrical Engineering, Applied Physics, Physics, Photonics, Mechanical Engineering, Materials Science, or a related field; B.S. with exceptional relevant experience also considered.
  • Industry experience in micro-optics, wafer-level optics, optical design, photonic packaging, optomechanics, precision optics, semiconductor process integration, or advanced optoelectronic hardware.
  • Experience designing microlens arrays, aspheric micro-optics, diffractive or hybrid micro-optical surfaces, compact optical elements, or package-level optical features with manufacturing constraints.
  • Proficiency with optical modeling and tolerancing in Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent.
  • Nice to have: FDTD-Zemax co-design experience, or equivalent EM-to-system optical modeling, especially where simulation outputs inform tolerances, angular/spectral response, surface geometry, or package-level decisions.
  • Nice to have: working knowledge of semiconductor processing or microfabrication, including lithography, etch, deposition, thin films, wafer-level metrology, process variation, design rules, or DFM.
  • Ability to convert requirements into an optical design, tolerance budget, supplier data package, and practical characterization plan.
  • Experience with prototype characterization, failure analysis, design iteration, and model-to-hardware correlation.
  • Python skills for simulation automation, numerical analysis, data reduction, and reporting.
  • Clear written and verbal communication; ability to operate independently in a fast-changing startup environment.
Helpful Experience
  • Taking wafer-level optics or micro-optical components from concept through prototype builds, supplier qualification, or production ramp.
  • High-density optoelectronic packages, semiconductor photonics packages, optical interconnect hardware, co-packaged optics, sensing systems, LiDAR, AR/VR optics, miniature imaging, or datacom hardware.
  • Semiconductor process collaboration: mask or layout review, critical-dimension data, SEM/AFM/profilometry interpretation, film-stack review, process-control limits, or interaction with a foundry/process team.
  • DFM, DVT, reliability screening, thermal cycling, humidity exposure, high-temperature storage, and environmental qualification.
  • Optomechanical CAD or GD&T using SolidWorks, NX, Creo, Zemax CAD exchange, or equivalent.
  • Lab automation with motion stages, cameras, optical power meters, OSAs, temperature controllers, SMUs, oscilloscopes, Python/PyVISA, SCPI, or LabVIEW.
How You Will Work
  • Owner mindset: drive ambiguous technical problems from first principles to measured hardware.
  • Bias for action: build lightweight experiments, define clear metrics, and iterate based on data.
  • Cross-functional fluency: communicate trade-offs across optics, semiconductor process, packaging, mechanical, thermal, test, reliability, and systems teams.
  • Builder mentality: create reusable models, scripts, specifications, and test methods.
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