Mechatronic Design and Release Engineer - In-Vehicle Infotainment

Ford; Dearborn (MI); On-site; USD 120,000 - 180,000; Full time

Job summary

Ford is seeking an experienced automotive hardware engineer to lead IVI and connectivity mechatronics integration from prototype to vehicle launch. You will drive power/thermal packaging, board/layout decisions, and antenna routing for optimal signal performance.

The role requires strong analytical skills, expertise in MATLAB/LTSpice/Mathcad, and advanced use of CANalyzer/CANoe. You will collaborate across engineering teams to meet safety and EMC standards and manage Tier 1 supplier activities.

Qualifications

• 5+ years of experience in automotive Design and Release (DR) or electronic hardware development.
• Experience with simulation/analysis tools MATLAB, LTSpice, and Mathcad.
• Mechatronic systems including display/touchscreen hardware, haptics, thermal management, and high-speed connector/antenna integration.
• Awareness of cybersecurity (ISO/SAE 21434), functional safety (ISO 26262) and EMC requirements for connected systems.

Responsibilities

• Support all vehicle prototype builds, product launch, and service issues related to IVI, gateway, and connectivity electronic hardware and mechatronic integration.
• Develop and execute comprehensive test plans, including original test cases and custom testing tools for bench and vehicle-level validation.
• Perform circuit simulations, power and thermal studies, and hardware-level analysis using LTSpice and MATLAB to ensure robust electronic design, including thermal management of high-performance SoCs and power stages.
• Lead power performance, thermal management, and packaging of IVI modules, including PCB layout density, enclosure design, EMI shielding, heat dissipation strategy, and power budget management.
• Lead integration of these systems into the vehicle, including module mounting, harness routing, thermal interfaces, and antenna placement for optimal cellular, GNSS, Wi-Fi, and V2X performance.
• Lead the troubleshooting and problem-resolution process using Vector CANalyzer/CANoe and high-speed network analysis tools; collect/analyze data and review schematics.

Skills

Strong analytical skills

Cross-functional collaboration

Problem solving

Education

BSEE (MSEE) or MS in Mechatronics Engineering preferred

Tools

MATLAB

LTSpice

Mathcad

CANalyzer

CANoe

Oscilloscopes

Multimeters

Thermal Imaging Cameras

Job description

In this position...

What you'll do...

• Support all vehicle prototype builds, product launch, and service issues related to IVI, gateway, and connectivity electronic hardware and mechatronic integration.
• Develop and execute comprehensive test plans, including the creation of original test cases and custom testing tools for both bench and vehicle-level validation.
• Perform circuit simulations, power and thermal studies, and hardware-level analysis using tools such as LTSpice and MATLAB to ensure robust electronic design, including thermal management of high-performance SoCs and power stages.
• Lead the power performance, thermal management, and physical packaging of IVI modules, including PCB layout density, enclosure design, EMI shielding, heat dissipation strategy, and power budget/quiescent draw management.
• Lead the integration of these systems into the vehicle, including module mounting, harness routing, thermal interfaces to vehicle structure, and antenna placement and routing for optimal cellular, GNSS, Wi-Fi, and V2X signal performance.
• Support the electromechanical integration of displays and touchscreens, including mounting, optical bonding, haptic feedback hardware, and thermal behavior of large-format displays.
• Lead the troubleshooting and problem-resolution process using vehicle network tools (Vector CANalyzer/CANoe) and high-speed network analysis tools. Collect and analyze data, review system schematics, and evaluate vehicle EDS as required.
• Collaborate closely with Component, Architecture, Systems Engineering teams to ensure hardware/software compatibility and alignment with vehicle electrical and connectivity requirements.
• Support the development of robust foundation documents, including DFMEA, Design Specifications, D/PVPR, and Worst-Case Circuit Analysis (WCCA).
• Lead technical design reviews for module hardware requirements, thermal/power interfaces, and mechanical/packaging interfaces.
• Manage Tier 1 supplier engineering activities on a case-by-case basis to ensure component delivery meets Ford's rigorous quality and timing standards.
• Lead cross-functional teams to drive timely resolution of program-specific engineering issues using failure detection strategies (Fishbone, 8D, etc.).
• Lead the delivery of all engineering requirements for IVI and connectivity mechatronic components per each development milestone, as defined by the Ford product development process.
• Develop solutions to revise or add features to infotainment and connectivity systems as they impact hardware, thermal/power performance, packaging, and electronic control logic.
• Ensure designs meet cybersecurity (ISO/SAE 21434), functional safety (ISO 26262), and EMC requirements for connected systems

You’ll have...

• BSEE (MSEE) or MS in Mechatronics Engineering preferred. Other disciplines may be considered if the candidate has comparable job experience.
• 5+ years of experience in automotive Design and Release (DR) or electronic hardware development.
• Expertise in simulation and analysis tools: MATLAB, LTSpice, and Mathcad.
• Advanced proficiency with Vector tools (CANalyzer, CANoe) and diagnostic hardware (Oscilloscopes, Multimeters, high-speed network/protocol analyzers, Thermal Imaging Cameras).
• Strong background in mechatronic systems, including display/touchscreen hardware, haptics, thermal management, and high-speed connector and antenna integration.
• Experience with power performance, thermal management, and physical packaging of high-performance electronic modules.
• Experience in developing custom test scripts or hardware-in-the-loop (HIL) testing setups.
• Strong analytical skills (including 8D, 6-Panel, FMEA) and experience with electronic circuit design and board layout.
• Familiarity with high-speed automotive networks and wireless communication, including Automotive Ethernet (100BASE-T1 / 1000BASE-T1) and TSN, CAN FD, LIN, display interfaces (LVDS, MIPI, GMSL, FPD-Link), USB, Wi-Fi, Bluetooth, cellular (4G/5G), G