Mechanical/Hardware Engineer (Thermal)

Hewlett Packard Enterprise; Chippewa Falls (WI); On-site; USD 74,000 - 170,000; Full time

Benefits offered by this job

Health & Wellbeing

Personal & Professional Development

Unconditional Inclusion

Job summary

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical/Hardware Engineer (Thermal) to tackle system level cooling challenges for server designs. You will work onsite, leading and collaborating with mechanical hardware teams on design, validation, and tooling, focusing on fan and heatsink technology, CFD validation, and robust thermal solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering and 2–4 years of experience, with strong communication skills and the

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 2-4 years experience.
• Experience with thermal simulation and testing.

Responsibilities

• Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
• Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
• Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.
• Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
• Provides guidance and mentoring to less- experienced staff members.
• Communicates well verbally, in writing, and graphically.
• Works independently and as part of a team.

Skills

3D CAD

CFD

Thermal analysis

Team leadership

Education

Bachelor's or Master's degree in Mechanical Engineering

Job description

Mechanical/Hardware Engineer (Thermal)

This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Who We Are

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description

Job Family Definition: Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing on new and modified designs. Leads and/or assists in architecture development and assessment. Evaluates reliability of materials, properties, designs, and techniques used in production. May direct support personnel and/or partner organizations in the preparation of detailed design, design testing, prototype fabrication, and production tooling. Responsible for addressing thermal challenges in support of server designs. This position entails developing and delivering cost effective cooling solutions that are best in class thermally and acoustically. Involves system level thermal design focusing on fan and heatsink technology, materials science, chemistry, fluid flow as well as system level control logic. The job will also include initial concept work, mechanical design, thermal simulation (Flotherm or other software) oversight, and creation of a mockup (dummy heat loads) and solution validation. Responsible for interfacing with vendors on an array of technical issues. Some foreign travel necessary.

Management Level Definition

Contributions include applying intermediate level of subject matter expertise to solve common technical problems. Acts as an informed team member providing analysis of information and recommendations for appropriate action. Works independently within an established framework and with moderate supervision.

Responsibilities

• Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
• Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
• Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.
• Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
• Provides guidance and mentoring to less- experienced staff members.
• Communicates well verbally, in writing, and graphically.
• Works independently and as part of a team.

Education and Experience Required

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 2-4 years experience.

Knowledge and Skills

• Using ProEngineer or other 3D CAD software as a mechanical design tool.
• Ability to apply analytical and problem solving skills.
• Designing sheet metal and plastic parts and associated production tooling and processes.
• Using CFD and thermal mockups to validate thermal solution.
• Strong written and verbal communication skills; mastery in English and local language.
• Ability to effectively communicate design proposals and negotiate options.

Other Knowledge and Skills

• Strong analytical and problem solving skills.
• Strong understanding and experience in electronics packaging.
• Designing sheet metal and plastic parts and associated production tooling and processes.
• Proficiency with CFD and thermal mockups to validate thermal solution.
• Excited about technology and has the desire to learn new tasks and technologies.
• Ability to learn risk management skills (understands risk, assesses risk qualitatively, and uses techniques to measure performance of subcontractors and vendors).

Accessibility

HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities.

What We Can Offer You

• Health & Wellbeing We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.
• Personal & Professional Development We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.
• Unconditional Inclusion We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Lets Stay Connected

Follow @HPECareers on Instagram to see the latest on people, culture and tech at HPE.

Job: Engineering

Job Level: TCP_02 “The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level. – United States of America: Annual Salary USD 74,000 - 170,300 in Wisconsin The listed salary range reflects base salary. Variable incentives may also be offered.”

Information about employee benefits offered in the US

Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer.

We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need.

Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together.

Equal Employment Opportunity is the Law

Equal Employment Opportunity is the Law

Equal Opportunity Employer (EEO)

Hewlett Packard Enterprise provides equal employment opportunity to any employee or applicant without regard to sex, gender, color, race, ethnicity, religion, creed, national origin, ancestry, citizenship, age, marital status, sexual orientation, gender identity and expression, physical or mental disability, medical condition, pregnancy, protected veteran status, uniformed service status, familial status, genetic information, political affiliation, or any other characteristic protected by federal, state, or local law.

Equal Employment Opportunity is the Law - Supplement E-Verify (US & PR only)

HPE is an E-Verify employer. E-Verify is an Internet-based system that compares information from an employee's Form I-9, Employment Eligibility Verification, to data from U.S. Department of Homeland Security and Social Security Administration records to confirm the employment eligibility of all newly hired employees. For more information.