Mechanical Design Engineer (R&D)

Ceragon Networks; Israel Township (OH); In loco; USD 90.000 - 130.000; Tempo pieno

Descrizione del lavoro

Ceragon Networks is seeking a Mechanical Engineer to drive the mechanical development of next generation company products from concept to mass production. You will work in a team, interfacing with key positions inside and outside the company to align design with manufacturing and performance goals.

The role requires hands-on experience in electronics packaging, CAD with SolidWorks, and a solid grasp of GD&T and tolerance stack-up.

Competenze

• BSc in Mechanical Engineering (MSc preferred).
• 5+ years in electronics packaging design.
• Knowledge of GD&T, drawings, tolerances.
• DFM experience: injection molding, casting, machining, stamping.
• Experience in electronic board design.
• Experience leading full life cycle projects.
• Experience with PLM systems, ECN, BOM structuring.
• Indoor/outdoor equipment design.
• Thermal, dynamical and static design/analysis.
• Telecommunication/RF equipment experience a plus.
• Mentoring engineers a plus.
• Proficiency in SolidWorks.
• Proficiency in English (writing and speaking).
• Self-motivated, able to work under pressure and multitask.
• Team player with strong technical and communication skills.

Mansioni

• Lead mechanical development from concept to mass production.
• Interface with cross-functional teams inside and outside the company.
• Ensure design for manufacturability and testability.

Conoscenze

GD&T understanding

Drawings

Assembly tolerances

Mechanical design

Team player

English communication

Formazione

BSc in Mechanical Engineering

MSc in Mechanical Engineering (advantage)

Strumenti

SolidWorks

PLM systems

Descrizione del lavoro

Description

mechanical development of next generation company products from concept up to mass production. Working in a team environment, engineer is interfacing with key positions in and outside the company.

Requirements

• Qualification: BSc in Mechanical Engineering from an accredited university. MSc an advantage
• At least 5 years of experience in electronics packaging design
• Strong understanding of GD&T, drawings, assembly tolerances
• Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
• Experience in electronic board design
• Experience in leading full life cycle projects
• Experience with PLM systems, engineering changes, BOM structuring, etc.
• Experience in design of indoor and outdoor equipment
• Experience in thermal, dynamical and statical design and analysis
• Experience in telecommunication/RF equipment - an advantage
• Experience in mentoring engineers - an advantage
• Perform analysis, testing, design iterations and validation of the designs
• Proficiency in SolidWorks
• Proficiency in writing as well as speaking in English
• Must be self-motivated, able to work under pressure, and multitask
• Team player with strong technical and communication skills