Mechanical Design Engineer

Viasat

Tempe (AZ)

Hybrid

USD 121,000 - 190,000

Full time

3 days ago
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Job summary

Viasat in Tempe, AZ is seeking a Mechanical Design Engineer to lead the design, documentation, and testing of electronics packaging and mechanical ground support equipment (MGSE) for space hardware.

You will perform thermal analyses, develop 3D parts in SolidWorks, and collaborate with cross-functional teams while adhering to MIL-STD-810 and other environmental standards. Hybrid role with three days in office.

Qualifications

  • 5+ years in mechanical design engineering for electronics packaging and space hardware.
  • Experience creating 3D parts/assemblies in SolidWorks.
  • Thermal analysis of electronics components from junction to assembly.
  • Familiarity with MIL-STD-810 environmental testing and related standards.

Responsibilities

  • Design electronics packaging and MGSE for space hardware.
  • Perform thermal analyses and ensure heat dissipation in assemblies.
  • Develop complex MGSE for assembly, test, and integration.
  • Collaborate with cross-functional teams including CM, supply chain, manufacturing.

Skills

Mechanical design
SolidWorks
Thermal analysis
MS Office
Communication

Education

B.S. Mechanical Engineering

Tools

ePDM
ANSYS Workbench
Thermal Desktop

Job description

About us

One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.

What you'll do

Viasat is looking for a dynamic Mechanical Design Engineer to join our growing team. In this exciting role, you will be responsible for the design, documentation, and testing of electronics hardware and mechanical support ground equipment (MGSE).

The day-to-day

The day to day work encompasses electronics packaging, cabling, thermal analysis down to the component junction level, structural analysis, and qualification testing. You will ensure the design has the proper parts, materials and interface design so each module operates as intended within its environmental and performance requirements. In addition, you will design complex mechanical ground support equipment (MGSE) to support assembly, test, and integration of space hardware. You will work directly with a diverse staff including engineering, configuration management, supply chain, manufacturing, and quality assurance to manage the product development.

What you'll need
  • 5+ years of experience in Mechanical Design Engineering including development of electronics packaging, ruggedized products, space hardware, and mechanical ground support equipment (MGSE).
  • Design experience creating 3D parts and assemblies using SolidWorks.
  • Experience in creating and analyzing models in thermal analysis software (Ansys, Thermal Desktop, SolidWorks Flow Sim or similar).
  • Experience performing thermal analysis of electronics components down to the junction level and managing heat dissipation within electronics assemblies.
  • Experience designing ruggedized products for harsh environments.
  • Experience working as part of a diverse team of multiple disciplines.
  • Ability to manage, allocate, and derive requirements, familiarity with MIL-STD-810 environmental testing and similar MIL standards.
  • Ability to create specifications and presentations.
  • Proficiency in MS Word, Excel, and Power Point.
  • Strong communication skills - both verbal and written.
  • Bachelor of Science in Mechanical Engineering or equivalent work experience
  • U.S. Citizenship Required.
  • Ability to obtain and maintain a U.S. Secret Clearance
  • Up to 10% of domestic travel. This is a hybrid role based out of Tempe, AZ (three days in office) #LI-BBS
What will help you on the job
  • Experience with SolidWorks and ePDM software.
  • Experience with designing mechanical ground support equation (MGSE).
  • Electronics packaging design experience.
  • Familiarity with space environmental requirements.
  • Experience with ANSYS Workbench or similar FEA software.
  • Active U.S. Secret Clearance.
Salary range

$120,500.00 - $190,000.00 / annually.

For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $149,500.00- $224,500.00/ annually

At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat's comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.

EEO Statement

Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.

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