Mechanical Advanced Packaging Engineer

SAIC; Indiana; Hybrid; USD 80,000 - 120,000; Full time

Job summary

SAIC is seeking an Advanced Packaging Engineer to design, analyze and validate high-reliability missile system packaging solutions in Crane, IN. You will work with multidisciplinary teams on mechanical modeling, materials, and qualification activities for complex defense hardware.

The role requires a BS in mechanical or aerospace engineering, 5+ years in FEA/MATLAB, knowledge of systems engineering, and eligibility for interim secret clearance with SAIC sponsorship.

Qualifications

• Bachelor’s degree in mechanical or aerospace engineering required.
• 5+ years of mechanical modeling and simulation experience (FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue).
• Experience with systems engineering principles and lifecycle stages.
• Interim secret clearance to start, with SAIC sponsorship to obtain secret clearance.

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly.
• Perform mechanical modeling and simulation activities including FEA, thermal fatigue, shock, and MATLAB-based modeling.
• Apply systems engineering through requirements development, verification and validation.
• Support technical reviews (SRR, PDR, CDR, PRR) and cross-functional design discussions.
• Collaborate with design teams to document development activities.
• Support TIMs and cross-functional team discussions.
• Analyze solder interconnect technologies (BGA, CGA, Flip-Chip, J-lead).
• Conduct experimental tests and material property evaluations.
• Communicate technical findings to both technical and non-technical stakeholders.

Skills

FEA/ANSYS

MATLAB

Vibration analysis

Shock analysis

Thermal fatigue

Systems engineering concepts

Education

Bachelor’s degree in mechanical or aerospace engineering

Tools

ANSYS

Job description

Description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN.

JOB RESPONSIBILITES:

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
• Collaborate with design teams to facilitate and document design development activities
• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

• Bachelor’s degree in mechanical or aerospace engineering
• 5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• Experience with or knowledge of systems engineering principles
• Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process
• Must be a US citizen

PREFERRED EXPERIENCE:

• Experience with missile system hardware design and analysis
• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Target salary range: $80,001 - $120,000. The estimate displayed represents the typical salary range for this position based on experience and other factors.