Manufacturing Technical Program Manager

AttoTude; Menlo Park (CA); On-site; USD 150,000 - 220,000; Full time

Job summary

AttoTude, located in Menlo Park, California, is seeking a Manufacturing Technical Program Manager to lead technical execution of new product introductions in advanced manufacturing technologies. This role requires strong integration across R&D and manufacturing engineering to ensure product readiness from technology development through to high-volume production.

Qualified candidates will have a Bachelor’s degree in Engineering, 8+ years of relevant experience, and expertise in wafer fabrication processes. The position offers a competitive salary range of $150,000 — $220,000 USD.

Qualifications

• 8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.
• Experience leading wafer-level or semiconductor-based products through production ramp.
• Ability to manage complex technical programs across multiple teams and sites.

Responsibilities

• Own end-to-end technical execution of NPI programs.
• Drive concurrent development with R&D and align manufacturing strategy.
• Define and manage technology readiness milestones.

Skills

Technology development and industrialization

Wafer fab and process integration

Technical program ownership

Cross-functional and cross-site communication

Yield, reliability, and manufacturability optimization

Education

Bachelor’s degree in Engineering or related discipline (Master’s preferred)

Tools

Wafer fabrication processes

Silicon wafer fab processes

Job description

About AttoTude, The World's First THz Radio Over Wire

AttoTude is at the forefront of revolutionizing data centers through advanced interconnect technology based on wired THz transceivers. By adapting the fiber from photonics and advancing today's ASICs to THz, our innovative AttoEngine eliminates networking bottlenecks, enabling high-speed interconnects for AI data centers.

Job Summary

The Manufacturing Technical Program Manager (MFG TPM) leads the development, industrialization, and execution of advanced manufacturing technologies spanning wafer fabrication, innovative wire solutions, and precision alignment/assembly processes. The role owns technical program strategy, readiness milestones, and execution cadence to mature new technologies from early development through high-volume production.

Serving as a technical bridge across R&D, wafer fabs, OSATs, Manufacturing Engineering, and CMs, the MFG TPM ensures alignment between design intent, process capability, yield, and manufacturing readiness across globally distributed teams. The role combines strong wafer-fab technical understanding with disciplined program leadership and hands‑on problem solving to support advanced datacenter hardware platforms.

Key Responsibilities

• Own end‑to‑end technical execution of NPI programs from technology development through production ramp.
• Drive concurrent development with R&D, aligning device architecture, process flows, and manufacturing strategy.
• Lead wafer fabrication industrialization, including lithography, deposition, etch, CMP, metrology, and yield ramp.
• Define and manage technology readiness milestones, build gates, and technical risk mitigation.
• Act as the primary technical integrator and escalation point across fabs, OSATs, Manufacturing Engineering, and CMs.
• Transition technologies from pilot builds into high‑volume fab and manufacturing environments.
• Establish yield learning, SPC, and control strategies and lead root cause resolution for process and reliability issues.
• Own technical change control and ensure clear, consistent communication across sites and partners.

Required Qualifications

• Bachelor’s degree in Engineering or related discipline (Master’s preferred).
• 8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.
• Proven experience leading wafer‑level or semiconductor‑based products through production ramp.
• Ability to manage complex technical programs across multiple teams, sites, and manufacturing partners.
• Experience working directly with wafer fabs, OSATs, and external manufacturing partners.

Preferred Qualifications

• Hands‑on experience with silicon wafer fab processes (lithography, etch, deposition, CMP, metrology).
• Experience with advanced packaging or interposers.
• Familiarity with high‑performance interconnects (wires, cables, connectors).
• Experience supporting datacenter, HPC, or performance‑critical hardware.

Key Competencies

• Technology development and industrialization.
• Wafer fab and process integration.
• Technical program ownership.
• Cross‑functional and cross‑site communication.
• Yield, reliability, and manufacturability optimization.

AttoTude is an equal opportunity employer. We’re committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic.

Annual Salary Range

$150,000 — $220,000 USD