Lead Wafer Bonding & Integration Engineer

Socket.dev

Santa Clara (CA)

On-site

USD 180,000 - 260,000

Full time

14 days+

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Job summary

nEye.ai in Santa Clara, CA is seeking a Wafer Bonding Integration Engineer to lead development, integration, and manufacturing transfer of advanced wafer bonding processes essential to our MEMS-based silicon photonics OCS product line.

You will partner with design teams and external foundries to deliver robust bonding solutions, drive NPI, and enable smooth transition to volume manufacturing, with a focus on yield, reliability, and process capability.

Qualifications

Advanced degree in Materials Science, Mechanical/Electrical Engineering, Physics, MEMS, or related field.
10+ years in new product introduction with wafer process integration and manufacturing experience.
Hands-on expertise with wafer bonding technologies (Fusion, Eutectic, Hybrid, Direct).
Experience with TSV, wafer thinning, cavity SOI, or 3D integration is beneficial.

Responsibilities

Own wafer bonding integration strategy from early development to high-volume manufacturing.
Collaborate with design, process development, and foundries to enable robust manufacture.
Lead transfer activities and ensure repeatable bonding solutions across partners.
Interface between internal teams and external fabrication partners throughout NPI.
Drive yield, schedule, quality, and reliability objectives for new products.