Intern - Next Gen HBM Platform Arch

Micron; Folsom (CA); Hybrid; USD 59,000 - 80,000; Full time

Job summary

Micron Technology in California is seeking an HBM Platform Architecture Intern to contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures and by building modeling tools.

You will work with experienced architects to analyze design trade-offs, develop automation tooling in Python, and collaborate with architecture, design, packaging, and technology teams to improve performance, power efficiency, reliability, and scalability for

Qualifications

• 0-2 years of relevant experience in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, or related fields.
• Currently pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering, or Computer Science.
• Coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration technologies.
• Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
• Ability to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.
• Strong analytical, problem-solving, and technical communication skills.
• Experience using AI-enabled tools and LLMs as part of engineering workflows, with ability to validate AI outputs.

Responsibilities

• Perform signaling and timing analysis for on-die and off-die interfaces across multiple system/topologies.
• Develop and evaluate thermal models to analyze heat transfer and performance in memory systems.
• Analyze power delivery networks, including IR-drop, EM, power integrity, and PDN optimization for HBM architectures.
• Develop modeling, simulation, and automation tools to support PDN, thermal, and architecture evaluations.
• Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and future HBM development.

Skills

Electrical engineering

VLSI design

Signal integrity

Power integrity

Thermal analysis

Semiconductor design

Analytical skills

Python

AI tools

Education

Bachelor's/Master's/PhD in Electrical Engineering or related

Tools

Cadence EDA

MATLAB

Thermal analysis tools

Signal integrity tools

Python

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products.

Responsibilities

• Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies.
• Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems.
• Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures.
• Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities.
• Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and support future HBM technology development.

Minimum Qualifications

• 0-2 years of relevant experience through internships, research projects, coursework, or academic projects in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, or related technical fields.
• Currently pursuing a Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related field.
• Coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration technologies.
• Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
• Ability to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.
• Strong analytical, problem-solving, and technical communication skills.
• Experience using AI‑enabled tools and large language models (LLMs) such as Copilot, Claude, ChatGPT, or similar technologies as part of engineering workflows, with the ability to validate and critically evaluate AI‑generated outputs.

Preferred Qualifications

• Familiarity with Cadence EDA tools, MATLAB, thermal analysis tools, signal integrity tools, or related engineering software.
• Knowledge of semiconductor packaging, assembly processes, heterogeneous integration, or advanced packaging technologies.
• Experience with analog design, I/O design, timing analysis, signal integrity, or system-level electrical modeling through coursework, research, or project work.
• Experience with thermal modeling, computational analysis, power delivery analysis, IR-drop, electromigration (EM), or power integrity evaluations.
• Knowledge of HBM, DRAM, memory interfaces, advanced interconnects, or high-speed signaling technologies.
• Experience developing engineering automation tools, simulation environments, data analysis workflows, or modeling frameworks using Python or similar programming languages.
• Demonstrated interest in semiconductor architecture, advanced memory technologies, AI infrastructure, and next-generation computing systems.

Compensation

• The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $50.24 - $50.24 an hour
• Additional compensation may include benefits, bonuses and equity.
• Our salary ranges are determined by role, level, and location.
• The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations.
• Within the range, individual pay is determined by work location and additional job‑related factors, including knowledge, skills, experience, tenure and relevant education or training.
• The pay scale is subject to change depending on business needs.
• Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
• Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity & Diversity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

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