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Micron Technology invites applications for an internship in the Metrology Technology Development group in Boise, Idaho. You will work on projects in Optical Thin Films, Overlay/Registration, Profiling/Topography, and other metrology techniques, applying data science to large data streams and AI-enabled tools.
Ideal candidates are pursuing MS or PhD in Engineering, Physics, or semiconductor-related fields, with interest in AI/ML, MATLAB/Python, and experience with data analysis.
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Are you energized by providing solutions, that no one else can? Would you like to enable groundbreaking semiconductor technology development? Do you have experience with Optical films, overlay, electrical, x-ray, profiling, and other physical characterization methods? Do you enjoy applying Data Science concepts to large data streams and data analysis challenges?
We are the lifeblood of Micron's technology development, providing in-fab data that quantifies the statistics of every process used to make the memory chips that are powering the mobile devices, data centers, autonomous cars, and of course personal computers in use across the globe. We continually evaluate new metrology methods, techniques, and equipment to deliver innovative process characterization, enabling the industry's leading technology portfolio. This position is for an internship in the Metrology Technology Development group in Boise, a growing city that is continuously listed as one of the top in the country. In Metrology, we work on projects meaningful to current and future semiconductor manufacturing needs. Our mission is to develop timely and innovative solutions to the tough challenges our process teams face as technology continues to scale to smaller devices and higher capacities. You will collaborate with engineers in Metrology, in Boise and across the globe, as well as other process areas. Projects may include focus on one or more of subject areas within the metrology group; Optical Thin Films, Scatterometry/OCD, X-Ray, Overlay/Registration, Profiling/Topography, FIB, or CDSEM.
We are increasingly using artificial intelligence (AI), machine learning (ML), and sophisticated analytics to accelerate metrology development, improve process characterization, and drive data-informed decision making. Successful candidates should demonstrate curiosity and willingness to use AI-enabled tools and data-driven methodologies to enhance productivity, problem solving, and innovation.
Six-months co-op and 3 months summer internships will be considered