Image Sensor Process Integration Engineer

onsemi

Hopewell Junction (NY)

On-site

USD 127,800 - 217,200

Full time

14 days+

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Job summary

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator on Image Sensor technologies. This will include driving continuous improvement on new processes, new pixel architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

Salary: base range $127,800–$217,200 exclusive of bonuses; Equal Opportunity Employer; strong benefits package. onsemi.com

Qualifications

BS in Engineering or Materials Science.
2–4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA.
Fluent in English (written & verbal).

Responsibilities

Support new product development from the development phase through manufacturing, including full documentation to support ONSEMI’s process change review.
Ability to work well within a global matrixed team and drive projects and results independently.
Ability to communicate effectively with all levels of the organization, including executive staff.
Ability to operate independently and account for high-level objectives in detailed execution plans.
A team player with strong listening skills who can take input and make informed decisions.
Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and Yield improvement.
Ability to use Probe, In-line test, and Failure analysis data to champion and follow through with process changes.
Proven experience and a deep knowledge and understanding of Image Sensor technology, as well as Pixel architecture and device performance, are highly preferred.
Broad, cross-functional experience in semiconductor development and manufacturing is preferred, with specialization in Image Sensors highly desirable.
Particular skills in BEOL Cu integration, Hybrid Bond, optical film stack deposition, and Back Side Illumination integration.
Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Shiny, Excensio, JMP, etc.
Drive cost reduction through yield enhancement and process simplification.