Hardware Intern 2027: Advanced Solder Processes

IBM

Town of Yorktown (NY)

On-site

USD 88,000 - 162,000

Full time

2 days ago

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Job summary

IBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.

Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.

Qualifications

Proficient in SMT soldering processes.
Collaborate within a team on the same project.
Analytical skills to assess solder joint results.
Openness to learn new skills and explore innovative ideas.

Responsibilities

Undertake studies of bonding and reflow techniques for HPC applications.
Assess effects between package constructions and bonding reflow methods.

Skills

SMT soldering

Team collaboration

Analytical skills

Willingness to learn

Education

High School Diploma/GED

Bachelor's Degree (preferred)

Job description

At IBM Research, we are the innovation engine of IBM. Exploring

what’s next in computing and shaping the technologies the world

will rely on tomorrow. From advancing AI and hybrid cloud to

pioneering practical quantum computing, we anticipate challenges

and unlock new opportunities for clients, partners, and society.

Working in Research means joining a team that accelerates

discovery at the intersection of high-performance computing, AI,

quantum, and cloud. You’ll collaborate with leading scientists,

engineers, and visionaries to push boundaries and turn ideas into

reality. With a culture built on curiosity, creativity, and

collaboration, IBM Research offers the opportunity to grow your

career while contributing to breakthroughs that transform

industries and change the world.

Your role and responsibilities

In this role you will undertake studies of advanced bonding and reflow techniques with potential applications to high performance computing. This role will include significant efforts towards understanding the effects between different package constructions and bonding reflow techniques, providing exposure to relevant packaging analysis methods.

Required education

High School Diploma/GED

Preferred education

Bachelor's Degree

Required technical and professional expertise

Candidate for this role is required to have the following expertise:

Studies in Physics, Microelectronics/EE, or a related discipline
Proficient in SMT soldering processes
Collaborate within a team on the same project
Analytical skills to assess results of solder joints after solder process.
Openess to learn new skills and explore innovative ideas.

Preferred technical and professional experience

Candidate for this role would also benefits from the following expertise:

Advanced studies Microelectronics/EE or physics
Deep knowledge of SMT assembly processes in respect to soldering
Solder joint evaluation knowledge to assess quality of the joint and
Knowledge how to improve solder connection based of different solder alloys and pure composition solders.
Summarize analytical results and draw comprehensive conclusions.

ABOUT BUSINESS UNIT

IBM Research is the organic growth engine of IBM and an innovation engine for our customers and partners. As part of this mission, IBM Research anticipates and examines 'What's Next in Computing' to ultimately create and integrate the technologies the world relies upon to solve big challenges and unlock new opportunities. We create and pioneer new markets for IBM, our partners and customers as exemplified in our ongoing quest to reach practical and large-scale quantum computing. Across IBM Research, we realize the power and potential to accelerate discovery with our partners and clients by combining the power of high performance computing, AI, and Quantum, all integrated through the hybrid cloud.

YOUR LIFE @ IBM

In a world where technology never stands still, we understand that, dedication to our clients success, innovation that matters, and trust and personal responsibility in all our relationships, lives in what we do as IBMers as we strive to be the catalyst that makes the world work better.

Being an IBMer means you’ll be able to learn and develop yourself and your career, you’ll be encouraged to be courageous and experiment everyday, all whilst having continuous trust and support in an environment where everyone can thrive whatever their personal or professional background.

Our IBMers are growth minded, always staying curious, open to feedback and learning new information and skills to constantly transform themselves and our company. They are trusted to provide on-going feedback to help other IBMers grow, as well as collaborate with colleagues keeping in mind a team focused approach to include different perspectives to drive exceptional outcomes for our customers. The courage our IBMers have to make critical decisions everyday is essential to IBM becoming the catalyst for progress, always embracing challenges with resources they have to hand, a can-do attitude and always striving for an outcome focused approach within everything that they do.

Are you ready to be an IBMer?

ABOUT IBM

IBM’s greatest invention is the IBMer. We believe that through the application of intelligence, reason and science, we can improve business, society and the human condition, bringing the power of an open hybrid cloud and AI strategy to life for our clients and partners around the world.

Restlessly reinventing since 1911, we are not only one of the largest corporate organizations in the world, we’re also one of the biggest technology and consulting employers, with many of the Fortune 500 companies relying on the IBM Cloud to run their business.

At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing and blockchain. Now it’s time for you to join us on our journey to being a responsible technology innovator and a force for good in the world.

IBM is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, genetics, pregnancy, disability, neurodivergence, age, or other characteristics protected by the applicable law. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

OTHER RELEVANT JOB DETAILS

Supplemental 1 employees may be eligible for up to 8 paid holidays, minimum of 56 hours paid sick time and the IBM Employee Stock Purchase Plan. IBM offers paid family medical leave and disability benefits to eligible employees where required by applicable law.
This position was posted on the date cited in the key job details section and is anticipated to remain posted for 15 days from this date or less if not needed to fill the role.
We consider qualified applicants with criminal histories, consistent with applicable law.

IBM will not be providing visa sponsorship for this position now or in the future. Therefore, in order to be considered for this position, you must have the ability to work without a need for current or future visa sponsorship.

The compensation range and benefits for this position are based on a full-time schedule for a full calendar year. The salary will vary depending on your job-related skills, experience and location. Pay increment and frequency of pay will be in accordance with employment classification and applicable laws. For part time roles, your compensation and benefits will be adjusted to reflect your hours. Benefits may be pro-rated for those who start working during the calendar year.

Job Title

Hardware Intern 2027: Advanced Solder Processes

Date posted

30-Sep-2026

Job ID

134618

City / Township / Village

Yorktown Heights

State / Province

New York

Country

United States