Hardware Engineering Internship (6-Month Program)
Microsoft
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Job summary
Microsoft is seeking a Hardware Engineering Internship (6-Month Program) in Redmond, WA, onsite. This hands-on program gives exposure to hardware engineering teams and practical product development experience.
The posted notes show H-1B sponsorship signals from MICROSOFT CORPORATION and DoL LCA disclosures. This internship offers a rigorous entry into hardware roles, with mentorship and real-world project work.
Job description
Microsoft is hiring a Hardware Engineering Internship (6-Month Program) for the Hardware Engineering team. Location: Redmond, WA, US. Work arrangement: onsite.
How well this role fits your profile.
Confirmed H‑1B sponsor. The Department of Labor record shows filings under MICROSOFT CORPORATION .
Filings 48,047
Approved 93.8%
Avg wage $142K
From public Department of Labor LCA disclosures. Sponsorship history is a signal about the employer, not a commitment on this role.
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