Hardware Design & Thermal Systems Intern

International Business Machines Corporation; San Jose (CA); On-site; USD 90,000 - 140,000; Full time

Job summary

IBM in the United States is seeking a Mechanical Engineer to help design and build hardware platforms powering AI era systems. You will work with a multidisciplinary team on mechanical systems, structures, and packaging for IBM zSystems, Power Systems, Storage, and Quantum initiatives.

Responsibilities include mechanical design, thermal analysis, FEM/FEA simulations, packaging integration, and cross-functional collaboration with electrical, firmware, and product teams.

Qualifications

• Pursuing a Bachelor's Degree in Mechanical Engineering or related majors.
• Prior experience in computer hardware or testing.
• Strong verbal and written communication skills.
• Growth minded, team focused, and outcome oriented.

Responsibilities

• Mechanical design and development of components, assemblies, and system-level structures.
• Thermal design, analysis, and testing, including heat transfer modeling, airflow optimization, and cooling solutions.
• Structural and vibration analysis, materials selection, and reliability engineering.
• Finite element modeling (FEM/FEA) for mechanical, thermal, or multiphysics simulations.
• Microelectronics and system-level packaging, including integration of processors, memory, power delivery, and high-density interconnects.
• Technology integration across electrical, thermal, mechanical, and manufacturing domains.
• System and component characterization, test planning, and validation.
• Manufacturability and assembly optimization, including tolerance analysis and DFMA principles.
• Cross-functional collaboration with electrical, firmware, and product engineering teams.
• Field and customer engineering support, including root cause analysis of mechanical or environmental issues.
• Product quality, reliability, and specification development.

Skills

Strong communication

Team collaboration

Engineering problem solving

Growth mindset

Passion for technology

Education

Bachelor's degree in Mechanical Engineering or related majors

Master's degree preferred

Job description

IBM in the United States is seeking a Mechanical Engineer to help design and build hardware platforms powering AI era systems. You will work with a multidisciplinary team on mechanical systems, structures, and packaging for IBM zSystems, Power Systems, Storage, and Quantum initiatives.

Responsibilities include mechanical design, thermal analysis, FEM/FEA simulations, packaging integration, and cross-functional collaboration with electrical, firmware, and product teams.