Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm Incorporated

San Diego (CA)

On-site

USD 68,000 - 91,000

Full time

9 days ago
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Relocation covered
Housing provided

Job summary

Qualcomm Technologies, Inc. offers a hardware engineering internship across multiple tracks, including GPU, CPU, Digital DV, and SoC Systems.

Interns will leverage electrical/computer engineering education to contribute to system design, RTL, and pre-silicon work during a 11–14 week summer program. You will be paired with a mentor, participate in professional development, and may receive relocation coverage and furnished housing for the duration of the internship.

Qualifications

  • Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
  • Must be available for 11–14 weeks during Summer 2027 (May–September)
  • Expected graduation date of November 2027 or later
  • 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog

Skills

C
C++
Python
Verilog
SystemVerilog
Electrical Engineering
Computer Engineering

Education

Bachelor/Master/PhD in EE/CS/related field

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Interns Group, Interns Group > Interim Engineering Intern - HW

General Summary
About Qualcomm

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Maximize Your Opportunities

Our internship hiring model routes candidates from this application into multiple project specific roles. Your "Profile Visibility" choice will guide how we manage your data across our systems. To be considered for the full breadth of internship opportunities, select the option to use your profile data for "Any Roles Globally".

If you choose to limit your data to "Only The Role I'm Applying For", it will restrict the opportunity for you to be considered across matching internship opportunities.

You can update your profile visibility preferences at any time through the Candidate Home Portal.

Steps
  • - Log Into Your Eightfold Candidate Home Account
  • - Hover Over The "Profile" Dropdown
  • - Open Settings
  • - Edit "Profile Visibility"
Role Overview

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of the following Qualcomm multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

This internship supports multiple technical tracks, including:

  • - GPU Engineering
  • - CPU Engineering
  • - Digital Design / DV
  • - SoC Systems Engineering

Based on your resume you may be aligned to one or more of these tracks. Please clearly indicate your track interest(s) in your resume , as this is the only way to communicate preferences during the recruiting process.

Minimum Qualifications
  • Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
  • Must be available for 11–14 weeks during Summer 2027 (May–September)
  • Expected graduation date of Nove mber 2027 or later
  • 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog
Preferred Qualifications
  • Candidates actively pursuing a degree with an anticipated graduation between Nove mber 2027 and June 2028
  • Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field
Track 1: GPU Engineering
  • Engineering design and development in MSM SOC and chipset architecture
  • ASIC implementation of image processing camera IP
  • GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
  • Graphics power analysis & optimization (Vulkan)
  • Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
  • Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python
Track 2: CPU Engineering
  • Validation of CPU and SOC-level micro-architecture concepts
  • Development of test and coverage plans, verification methodology, and scalable environments
  • Execution of verification plans including regression, debug, and bring-up
  • Familiarity with simulators, coverage tools, waveform viewers
  • Programming experience in C, C++, Python
Track 3: Digital Design / DV
  • RTL development for modem physical and MAC layer processing
  • Verification component development using SystemVerilog and UVM
  • Modeling cellular modem datapaths for bit-exact correctness
  • Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
  • Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
  • Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab
Track 4: SoC Systems Engineering
  • Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
  • System-level performance modeling and simulation
  • Power and thermal management strategies
  • Post-silicon validation and characterization
  • Embedded software design, driver development for Linux/Windows
  • OS principles and HW/SW interaction
  • Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
  • Understanding of power/performance tradeoffs and system-level architecture
  • Programming experience in C/C++, Python; scripting and profiling tools
Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs : Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.

Future Employment Considerations

This internship aligns to a potential role that is not eligible for Qualcomm immigration sponsorship.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export

Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.

Applicants

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability‑accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies

Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits

Pay range and Other Compensation & Benefits :
$17.00 - $98.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Relocation and housing for internship
Mechanical Engineering Internship – Summer 2027
Mechanical Engineering Internship – Summer 2027

Qualcomm • Austin (TX)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing accommodations
Software Engineering Internship - Summer 2027
Software Engineering Internship - Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 55,000 - 110,000
Automotive Engineering Internship – Summer 2027
Automotive Engineering Internship – Summer 2027

Qualcomm Incorporated • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
IT Infrastructure & Cloud Engineering Internship – Summer 2027
IT Infrastructure & Cloud Engineering Internship – Summer 2027

Qualcomm Incorporated • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Competitive hourly pay
Mechanical Engineering Internship – Summer 2027
Mechanical Engineering Internship – Summer 2027

Qualcomm • Santa Clara (CA)

On-site
USD 23,000 - 135,000
Relocation covered
Furnished housing
Wireless Systems Engineering Internship - Summer 2027
Wireless Systems Engineering Internship - Summer 2027

Qualcomm • Boxborough (MA)

On-site
USD 23,000 - 135,000
Software Engineering Internship - Summer 2027
Software Engineering Internship - Summer 2027

Qualcomm • New Jersey

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Software Engineering Internship - Summer 2027
Software Engineering Internship - Summer 2027

Qualcomm • Boxborough (MA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing accommodations
Competitive hourly pay
+1
Software Engineering Internship - Summer 2027
Software Engineering Internship - Summer 2027

Qualcomm • Austin (TX)

On-site
USD 81,000 - 135,000
Relocation coverage
Furnished housing
Professional development workshops