Firmware Engineer - AI-Ready Embedded Systems

Sweep360 Inc.

New York (NY)

On-site

USD 198,000 - 242,000

Full time

14 days+
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Benefits offered by this job

Equity
Premium insurance
401(k)
Flexible PTO

Job summary

Sweep360 Inc. is seeking a Firmware Engineer to build systems that operate in real environments and survive contact with reality. You’ll own firmware that ships into high-stakes environments and work closely with the hardware lead and embedded teams in New York City.

You’ll collaborate across web, mobile, and internal tooling, deploying with cloud services and turning customer workflows into production capabilities using LLMs, graph reasoning, and sensor data. Some travel may be required.

Qualifications

  • 4–8 years shipping reliable production systems.
  • Experience with TypeScript, Python, and systems languages like Rust or Go.
  • Experience deploying with AWS or GCP in production.
  • U.S. Person status required; may involve export-controlled data.

Responsibilities

  • Own user-facing systems and internal tools.
  • Build product systems across web, mobile, and internal tooling.
  • Integrate with backend systems and deploy product-facing services.
  • Turn customer workflows into production product capabilities using LLMs, graph reasoning, and sensor data.
  • Ensure reliability through testing, automation, and tight feedback loops.
  • Work directly with customers and deployments globally (~10–15% travel).

Skills

Production systems engineering
Polyglot programming
Cloud deployment (AWS/GCP)
Software quality
LLMs/vector DBs integration
Startup experience
U.S. Person status

Job description

Sweep360 Inc. is seeking a Firmware Engineer to build systems that operate in real environments and survive contact with reality. You’ll own firmware that ships into high-stakes environments and work closely with the hardware lead and embedded teams in New York City.

You’ll collaborate across web, mobile, and internal tooling, deploying with cloud services and turning customer workflows into production capabilities using LLMs, graph reasoning, and sensor data. Some travel may be required.

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