Failure Analysis Engineer

Avicena Tech

Sunnyvale (CA)

On-site

USD 140,000 - 210,000

Full time

14 days+

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Benefits offered by this job

Competitive compensation
Equity
Comprehensive benefits

Job summary

Avicena Tech in Sunnyvale, CA is seeking a Failure Analysis Engineer to isolate, characterize, and root-cause failures in GaN microLEDs and photodetector arrays. You will drive end-to-end FA from failure isolation to corrective actions, informing design, process, packaging, and reliability teams.

The role requires 5–8+ years in FA for semiconductor/optoelectronic devices, strong data analysis (Python/MATLAB), and deep device physics knowledge.

Qualifications

  • MS or PhD in Electrical Engineering, Materials Science, Physics, or related field.
  • 5–8+ years of failure analysis experience in semiconductor, optoelectronic, or photonic devices.
  • Root-cause rigor: 8D, fishbone, fault-tree investigations to definitive physical conclusions.
  • Device physics: understanding of semiconductor and optoelectronic device physics and failure mechanisms.
  • Data analysis and scripting (Python, MATLAB) and clear technical communication.

Responsibilities

  • Lead end-to-end failure analysis of GaN microLEDs, photodetector arrays, and interconnect modules from isolation to root cause and corrective action.
  • Plan and perform electrical, optical, and physical FA including EL/PL imaging, SIMS, EMMI/photoemission, OBIRCH/thermal, curve tracing, and fault localization.
  • Direct cross-sectioning and imaging (FIB, SEM, TEM, EDX, CT) to identify defects and interface issues.
  • Build failure signatures and defect libraries; distinguish process-, design-, and stress-induced failures.
  • Translate FA findings into actionable recommendations for device, process, packaging, and reliability teams; verify corrective actions.
  • Produce clear FA reports and present root-cause conclusions to engineering and leadership.

Skills

Data analysis
Python
MATLAB
FA techniques
Root-cause analysis

Education

MS/PhD in Electrical Engineering, Materials Science, Physics
BS with equivalent industry experience

Tools

FIB
SEM
TEM
EDX
OBIRCH/thermal
SIMS

Job description

Job Description

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)

Job Title

Failure Analysis Engineer

Job Description

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)

About The Role

As a Failure Analysis Engineer at Avicena, you will be the technical detective behind our microLED and photodetector device programs — isolating, characterizing, and root-causing failures across devices, arrays, and integrated modules. Your findings will directly steer design, process, and reliability decisions for the LightBundle platform, closing the loop between what fails in the lab and how we build it better.

Responsibilities
  • Root-cause analysis: Lead end-to-end failure analysis of GaN microLEDs, photodetector arrays, and integrated interconnect modules, from failure isolation through physical root cause and corrective action.
  • FA techniques: Plan and perform electrical, optical, and physical FA including EL/PL imaging, SIMS, EMMI/photoemission, OBIRCH/thermal, curve tracing, and fault localization on single devices and dense arrays.
  • Physical analysis: Direct and interpret cross-sectioning and imaging (FIB, SEM, TEM, EDX, CT/acoustic microscopy) to identify defects, material anomalies, and interface issues.
  • Failure characterization: Build failure signatures and defect libraries; distinguish process-induced, design-induced, and stress-induced failure modes.
  • Feedback loop: Translate FA findings into actionable recommendations for device, process, packaging, and reliability teams, and verify effectiveness of corrective actions.
  • Reporting: Produce clear, rigorous FA reports and present root-cause conclusions to engineering and leadership; support customer and foundry-facing analyses.
Qualifications
  • Education: MS or PhD in Electrical Engineering, Materials Science, Physics, or a related field (or BS with equivalent industry experience).
  • Experience: 5–8+ years of failure analysis experience in semiconductor, optoelectronic, or photonic devices.
  • Root-cause rigor: Demonstrated ability to drive structured root-cause investigations (8D, fishbone, fault-tree) to definitive physical conclusions.
  • Device physics: Solid understanding of semiconductor and optoelectronic device physics and common failure/degradation mechanisms.
  • Analysis skills: Proficiency in data analysis and scripting (e.g., Python, MATLAB) and strong technical communication.
Preferred Qualifications
  • GaN microLEDs: Prior experience with GaN-based microLED or LED/laser failure analysis is strongly preferred but not required.
  • Experience with FA on high-density emitter or detector arrays.
  • Familiarity with packaging, hybrid bonding, or heterogeneous-integration failure modes.
  • Experience supporting reliability qualification and correlating FA to stress-test results.
  • Background in optical/photonic module or interconnect FA.
Compensation, Benefits & EEO

Avicena offers a competitive compensation package including base salary, equity, and comprehensive benefits, along with the opportunity to make foundational contributions to a category-defining technology. Actual compensation will be determined based on experience, qualifications, and location. Avicena is an Equal Opportunity Employer. We are committed to building a diverse and inclusive team and do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other protected characteristic. Applicants must be authorized to work in the United States.

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