Embedded Design Engineer Intern

Vertiv

Delaware (OH)

On-site

USD 25,000 - 36,000

Full time

14 hours ago
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Job summary

Vertiv is seeking a dedicated Engineering Intern for its Core Engineering team in the United States. The role focuses on hardware and firmware development, with opportunities to work across Design Engineering, Test Engineering, and GenAI-enabled projects.

You will contribute to firmware/software on embedded environments, learn Agile processes, and stay current with data analytics trends while collaborating with a cross‑functional team to deliver high‑quality results.

Qualifications

  • Must be pursuing a degree in Computer Engineering, Computer Science, or a related field.
  • Excellent written and verbal communication skills.
  • Demonstrated work ethic and detail‑orientation.
  • Strong analytical and critical thinking skills.
  • Ability and willingness to learn in a fast‑paced environment and produce high‑quality work.

Responsibilities

  • Development of firmware/software on embedded Yoto Linux environment.
  • Create new features/software/development with the use of GenAI tools.
  • Learn and use Agile Development for product design and test.
  • Monitor data quality and integrity, identifying discrepancies and collaborating with the team to resolve them.
  • Stay updated with trends in data analytics and apply new techniques.

Skills

Communication skills
Detail-oriented
Analytical thinking
Quick learner
Team collaboration

Education

Pursuing Computer Engineering/CS

Tools

Embedded Linux
GenAI tools

Job description

Vertiv is seeking a dedicated Engineering Intern for its Core Engineering team in the United States. The role focuses on hardware and firmware development, with opportunities to work across Design Engineering, Test Engineering, and GenAI-enabled projects.

You will contribute to firmware/software on embedded environments, learn Agile processes, and stay current with data analytics trends while collaborating with a cross‑functional team to deliver high‑quality results.

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