Electromechanical Packaging Engineer III - Electro-Optical Components

Blue Origin

Denver (CO)

On-site

USD 120,000 - 168,000

Full time

8 days ago

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical, dental, vision insurance
401(k) with company match
Paid time off & holidays
Stock options
Education Support Program

Job summary

Blue Origin is seeking a senior packaging engineer to own ruggedized enclosures, electro-optical assemblies, and fiber-optic integration for space hardware. You will lead mechanical and thermal design across the full lifecycle, set standards, and partner with avionics and structures teams to deliver flight-qualified hardware.

You will work on production-ready packaging, drive analyses, and mentor engineers in a fast-moving program while ensuring safety, security, and reliability for missions

Qualifications

  • B.S. in Mechanical, Aerospace, Optical, or Photonics Engineering and 3–5+ years designing electromechanical or electro-optical assemblies.
  • Experience packaging electro-optical hardware with thermal, optical-interface and contamination challenges.
  • Strong 3D CAD skills and GD&T with ASME Y14.5 drawing practice.
  • Eligibility to obtain and maintain a U.S. government security clearance.

Responsibilities

  • Own complex packaging assemblies across the full lifecycle from requirements through production support.
  • Lead the mechanical and thermal design of modem processing and photonics units for flight-qualifiable packaging.
  • Own the mechanical thermal design with thermal engineering: heat rejection paths, mounting, and thermal control.
  • Own fiber optic tray design and internal fiber management, routing, and splice retention.
  • Collaborate with electrical engineers and PCB designers from architecture through test and integration.
  • Drive thermal, structural, vibration, shock, and fatigue analyses and manage tolerance stacks.

Skills

3D CAD (Creo)
GD&T
Thermal design
Cross-functional collaboration
Security clearance eligibility
Mechanical packaging

Education

B.S. in Mechanical/Aerospace/Optical/Photonics Engineering

Tools

Creo/Pro-E
ANSYS/FloTHERM
Altium
Windchill

Job description

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!

This role is part of Blue National Security (BNS), where our focus is the design, development, and delivery of launch and spacecraft systems for national security missions. Through Blue Ring, our all-in-one, high-powered hybrid solar-electric and chemical-propelled spacecraft, we provide unmatched mission maneuverability, versatility, and capacity at dramatically lower-profile costs.

Build the Hardware That Survives Space

Space is unforgiving: extreme temperatures, violent vibration and shock, radiation, and vacuum. The electronics and photonics flying on Blue Origin spacecraft have to survive all of it. We need an experienced packaging engineer to own ruggedized enclosures, electro-optical assemblies, and fiber-optic integration from concept through flight release. This role supports classified programs. Candidates must be eligible to obtain and maintain a U.S. government security clearance. An existing clearance is preferred but not required; we’re glad to sponsor the right candidate.

The Mission

Blue Origin is building the infrastructure for humanity's future in space. Optical communications is becoming a core capability for high-rate space networking, and the hardware that makes it work has to hold tight thermal stability and precise optical interfaces while surviving launch and years on orbit. That's fundamentally a mechanical and thermal problem, and it's the one this team solves. You'll own the mechanical design of the electro-optical units at the center of that system: modem processing and photonics units, electro-optic assemblies, transceiver hardware, and optical amplifier assemblies, plus the chassis and stacked-unit architectures that house them. The thermal paths that keep lasers, modulators, and receivers stable enough to close a link are yours, along with the fiber optic tray and every fiber run, splice, and junction inside the box, and the interfaces that let your units mount to the optical payload and host spacecraft. You'll work closely with electrical engineers and PCB designers throughout, because on hardware this dense, mechanical, thermal, and electrical design converge or fail together. As the senior technical voice for electro-optical packaging on a team with deep spacecraft avionics, structures, and thermal heritage, you'll set the design standards, analysis methods, and process baselines the team builds on.

What You’ll Do
  • Own complex packaging assemblies including enclosures, chassis, card-cage and stacked-unit architectures, mounting systems, and fiber junction housings, across the full lifecycle from requirements through production support.
  • Lead the mechanical and thermal design of modem processing and photonics units, integrating high-speed digital boards, photonics boards, electro-optic daughter cards, and power conversion slices into flight-qualifiable, mass- and volume-efficient packages. Package optical amplifier and transceiver-class hardware, addressing high optical power handling, fiber end-face reliability, hermeticity, and moisture control.
  • Own the mechanical thermal design with thermal engineering: heat rejection paths, mounting materials, heater placement, thermal isolation, and thermal control of tunable lasers, modulators, and TEC-cooled devices, where drift drives calibration burden and link margin.
  • Own fiber optic tray design and all internal fiber management: layout, routing, bend-radius control, strain relief, splice retention, and connector selection. Define the splicing and workmanship processes and specify the equipment to execute them. Define mechanical and installation requirements for electrical harnesses and carry them through detailed design with harness designers.
  • Collaborate with electrical engineers and PCB designers from architecture through layout, fabrication, and test. In ECAD/MCAD co-design, converge board outline, component floor planning, heat-source placement, and connector location, and weigh in on component and BOM decisions where mechanical and thermal factors matter, including junction-temperature margin and derating trades. Define board-level protection and workmanship: staking, conformal coating, bonding, and component restraint for vibration and shock.
  • Drive thermal, structural, vibration, shock, and fatigue analyses. Own tolerance stack-ups and thermo-elastic stability budgets that protect optical interfaces and coupling efficiency across environments. Lead trade studies balancing mass, thermal and structural performance, EMI/EMC, manufacturability, cost, schedule, and risk.
  • Own the mechanical, thermal, environmental, EMC, mass, and envelope requirement set. Decompose host requirements into verifiable requirements, maintain traceability, and report mass properties against host allocations. Negotiate host vehicle accommodation, including mounting interfaces, mass and CG envelopes, thermal limits, and dynamic environment levels. When hardware qualified to one standard meets a different host spec, quantify the gap and drive it closed.
  • Deliver models, drawings, specifications, and release packages, including mechanical and thermal ICDs. Apply GD&T per ASME Y14.5. Address space-optics risks such as contamination control, outgassing, hermeticity, and radiation-induced fiber attenuation, and support radiation and reliability teams on part selection and long-lead procurement.
  • Design for production. Apply DFM/DFA, specify fiber and optical assembly processes, and partner with fabrication and assembly suppliers on producibility. Own test and integration support, including fixtures and optical loopback setups, and shape environmental test campaigns from planning through anomaly closeout.
  • Mentor engineers, lead design reviews, and build team capability in electro-optical packaging. Perform all work in accordance with applicable security requirements, protecting classified information and controlled technical data.
What You Bring
  • B.S. in Mechanical, Aerospace, Optical, or Photonics Engineering, or a related discipline, plus 3 to 5+ years designing electromechanical or electro-optical assemblies, electronics or photonics packaging, or comparable high-reliability hardware, with a track record of owning designs from requirements through production.
  • Hands-on experience packaging electro-optical hardware (coherent or high-speed optical modems, transceivers, optical amplifier assemblies, photonic devices, lasers or detectors, or fiber-optic assemblies), including the thermal, optical-interface, and contamination challenges that come with it.
  • Demonstrated experience designing fiber management inside a constrained enclosure: tray layout, routing, bend-radius and strain-relief strategy, splice retention, and connector selection, plus thermal management of temperature-sensitive photonics, including TEC integration and thermal isolation.
  • Experience integrating PCBAs, connectors, and cable or fiber interfaces into mechanical assemblies, with a history of close collaboration with electrical engineers and PCB designers on dense, high-reliability boards, participating in layout reviews and influencing component selection before layout locks. Experience specifying mechanical and installation requirements for electrical harnesses.
  • Knowledge of ruggedized electronics and photonics design: thermal management, structural protection, vibration and shock survival, vacuum compatibility, and EMI/EMC shielding, plus experience conducting or directing the supporting analyses.
  • Ability to define and hold mechanical and thermal interfaces in both directions: specifying what your hardware requires from the host vehicle, and negotiating with the engineers who own adjacent optical, structural, and payload hardware.
  • Strong 3D CAD skills (Creo/Pro-E a plus) and solid command of GD&T, tolerance stack-ups, and ASME Y14.5 drawing practice.
  • Eligibility to obtain and maintain a U.S. government security clearance.
  • Comfort in a fast-moving program with evolving requirements and open trades: the judgment to make defensible decisions before every input is final, and the communication skills to make technical risk clear.
Bonus Points For
  • An active U.S. government security clearance, and/or an M.S. in a relevant discipline.
  • Experience with optical communications hardware (coherent or IM-DD transceivers, silicon photonics, optical modems, optical amplifiers, or pluggable form factors), and experience building modems, transceivers, or optical terminal electronics to standards such as SIS-002, OpenZR+, SDA optical communications terminal standards, or CCSDS optical standards, including how changes there propagate into mechanical and thermal design.
  • Working knowledge of laser communications terminal architecture and coherent link building blocks, such as integrated coherent receivers, modulators, tunable sources, and amplifiers, and what each demands mechanically and thermally.
  • Experience developing hosted payloads or line-replaceable units against a spacecraft bus interface specification, and familiarity with spacecraft environmental specifications and qualification tailoring, such as NASA GEVS and SMC-S-016, including payload isolation as a way to reconcile hardware capability with host environments.
  • Experience maturing prototypes into producible, qualifiable flight products, including reconstructing design documentation for hardware you didn't originally design.
  • Fiber-optic depth: splicing, connector and termini selection (MIL-PRF-29504, ARINC 801), cleaning and inspection practice (IPC-8497-1), link loss budgeting, and familiarity with IPC-A-620 and J-STD-001, plus experience with photonic and semiconductor assembly processes such as die attach, wire bond, flip chip, hermetic sealing, and fiber alignment.
  • Analysis depth in electronics thermal, structural, vibration, shock, or fatigue work, including solder-fatigue methods such as Steinberg or Engelmaier and FEA/thermal simulation in ANSYS or FloTHERM, plus hands-on familiarity with ECAD tools such as Altium or Mentor xPedition and PLM tools such as Windchill.
  • Familiarity with qualification and reliability standards such as Telcordia GR-468-CORE and GR-1221, MIL-STD-883, MIL-STD-1678, or JEDEC, plus experience with radiation-tolerant part selection and contamination control for space optics, including outgassing screening per ASTM E595.
  • Background in spacecraft, national-security space, human spaceflight, launch vehicle, or other extreme-environment hardware, ideally on long-duration or high-radiation missions beyond LEO, plus a track record of mentoring engineers and building new design or analysis capability on a team.
Base Pay Range for:

CO applicants is $119,814.00 - $167,738.55
Other site ranges may differ

Culture Statement

Don’t meet all desired requirements? Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At Blue Origin, we are dedicated to building an authentic workplace, so if you’re excited about this role but your past experience doesn’t align perfectly with every desired qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.

Export Control Regulations

Applicants for employment at Blue Origin must be a U.S. citizen or national, U.S. permanent resident (i.e. current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Background Check

Required for all positions: Blue’s Standard Background Check
Required for Certain Job Profiles: Defense Biometric Identification System (DBIDS) background check if at any time the role requires one to be on a military installation
Required for Certain Job Profiles: Drivers who operate Commercial Motor Vehicles with a Gross Vehicle Weight (GVW), Gross Vehicle Weight Rating (GVWR) or combination of power unit and trailer that meets or exceeds 10,001 lbs. and/or transports placardable amounts of hazardous materials by ground in any vehicle on a public road while in commerce, may be subject to additional Federal Motor Carrier Safety Regulations including: Driver Qualification Files, Medical Certification (obtained before onboarding), Road Test, Hours of Service, Drug and Alcohol Testing, vehicle inspection requirements, CDL requirements (if applicable) and hazardous materials transportation/shipping training.
Required for certain Job Profiles: Ability to obtain and maintain Merchant Mariner Credential, which includes pre-employment and random drug testing as well as DOT physical

Benefits
  • Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
  • Stock Options for all regular employees (working at least 20 hours/week)
  • Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
  • Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.
Equal Employment Opportunity

Blue Origin is proud to be an Equal Opportunity/Affirmative Action Employer and is committed to attracting, retaining, and developing a highly qualified and dedicated work force. Blue Origin hires and promotes people on the basis of their qualifications, performance, and abilities. We support the establishment and maintenance of a workplace that fosters trust, equality, and teamwork. We provide all qualified applicants for employment and employees with equal opportunities for hire, promotion, and other terms and conditions of employment, regardless of their race, color, religion, sex, sexual orientation, gender identity, national origin/ethnicity, age, physical or mental disability, genetic factors, military/veteran status, or any other status or characteristic protected by federal, state, and/or local law. Blue Origin will consider for employment qualified applicants with criminal histories in a manner consistent with applicable federal, state, and local laws, including the Washington Fair Chance Act, the California Fair Chance Act, the Los Angeles Fair Chance in Hiring Ordinance, and other applicable laws. For more information on “Know Your Rights,” please see here .

Affirmative Action and Disability Accommodation

Applicants wishing to receive information on Blue Origin’s Affiantive Action Plans, or applicants requiring a reasonable accommodation in order to participate in the application and/or interview process, please contact us at EEOCompliance@blueorigin.com . Please note this is a publicly managed inbox. Please do not include any personal medical information in your request.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Electromechanical Packaging Engineer III - Electro-Optical Components
Electromechanical Packaging Engineer III - Electro-Optical Components

Blue Origin • Longmont (CO)

On-site
USD 120,000 - 168,000
Stock options
401(k) with company match
Paid time off and education support
Principal Electro-Optics Engineer - Optical Inter-Satellite Link
Principal Electro-Optics Engineer - Optical Inter-Satellite Link

Blue Origin • Huntsville (AL)

On-site
USD 173,000 - 243,000
Medical, dental, vision
401(k) with company match
Stock options
+2
Principal Optical Communications Architect
Principal Optical Communications Architect

Blue Origin • Reston (VA)

On-site
USD 161,000 - 237,000
Relocation assistance
Travel up to 25%
Security clearance preferred
Principal Electrical Engineer, Mixed-Signal & Compute Systems (OISL Payload) - TeraWave
Principal Electrical Engineer, Mixed-Signal & Compute Systems (OISL Payload) - TeraWave

Blue Origin • Seattle (WA)

On-site
USD 249,000 - 349,000
Medical, dental, vision
401(k) with company match
Stock options
+1
Principal Optical Communications Architect
Principal Optical Communications Architect

Blue Origin • Denver (CO)

On-site
USD 161,000 - 225,000
Medical/Dental/Vision
Stock options
Parental leave
+2
Sr. Electromechanical Packaging Engineer - Electro-Optical Components
Sr. Electromechanical Packaging Engineer - Electro-Optical Components

Blue Origin • Denver (CO)

On-site
USD 144,000 - 202,000
Principal Electro-Optics Engineer – Optical Inter-Satellite Link
Principal Electro-Optics Engineer – Optical Inter-Satellite Link

Blue Origin • Denver (CO)

On-site
USD 173,000 - 243,000
Stock options
Comprehensive benefits
Paid time off
Sr. Mechanical Engineer - Avionics Packaging, RF Payloads - TeraWave
Sr. Mechanical Engineer - Avionics Packaging, RF Payloads - TeraWave

Blue Origin • Seattle (WA)

On-site
USD 145,000 - 203,000
Medical insurance
Dental insurance
Vision insurance
+7
Senior Thermal Engineer – Constellations
Senior Thermal Engineer – Constellations

Blue Origin • Denver (CO)

On-site
USD 144,000 - 202,000
Relocation assistance
Up to 25% travel
Manufacturing Engineer II - Optical
Manufacturing Engineer II - Optical

Blue Origin • Seattle (WA)

On-site
USD 92,000 - 129,000
Medical, dental, vision insurance
Life insurance
401(k) with company match
+3