ElectroMechanical Packaging design engineer

Intel Corporation; Dallas (TX); Hybrid; USD 80,000 - 110,000; Full time

Job summary

An established industry player is seeking an experienced ElectroMechanical Packaging Design Engineer to join their dynamic team in Dallas, Texas. This full-time role focuses on hardware development for military electronics, emphasizing innovative design and collaboration with cross-functional teams. The ideal candidate will have a background in electronic packaging and military defense design, with proficiency in tools like Pro-E/Creo and AutoCAD. The company fosters a culture of diversity and inclusion, providing flexible work schedules and remote telework options. If you're looking to make an impact in a cutting-edge environment, this opportunity is for you.

Benefits

Flexible work schedules

Part-time remote telework available

Diversity and inclusion initiatives

Qualifications

• Secret Clearance is required.
• Experience in Military Defense design is essential.

Responsibilities

• Design and develop hardware for military electronics.
• Collaborate with cross-functional teams for hardware integration.

Skills

Design experience with PWBs / CCAs and harnesses

Proficiency with Pro-E/Creo

Experience in Electronic Packaging

Knowledge of CREO

RF packaging Design Experience

AutoCAD experience

Zuken E3 Experience

Education

Bachelor’s degree in an engineering or related field

Tools

Pro-E/Creo

Windchill

AutoCAD

Zuken E3

Job description

Lockheed Martin - ElectroMechanical Packaging Design Engineer

Lockheed Martin is seeking an experienced ElectroMechanical Packaging Design Engineer to join their team in Dallas, Texas. This is a full-time, first shift position with potential for relocation.

Job Description:

This role involves hardware development of military electronics within flight-worthy assemblies. The engineer will collaborate with cross-functional teams to complete hardware designs and support integration efforts for the designated electronic system.

Key Responsibilities:

1. Design and develop hardware for military electronics, including processors, interface electronics, power cards, and flexes.
2. Work within physical and thermal constraints, requiring experience with high-density electronic packaging.
3. Create and demonstrate reference designs to support multiple contract wins within the RF Center of Excellence.
4. Collaborate with cross-functional teams for seamless hardware integration.

Qualifications:

Basic Qualifications:

• Secret Clearance
• Design experience with PWBs / CCAs and harnesses
• Proficiency with Pro-E/Creo, Windchill, and LM design processes
• Bachelor’s degree in an engineering or related field
• Experience in Electronic Packaging and Military Defense design

Desired Skills:

• Experience as a Packaging Lead
• Knowledge of CREO
• Experience with PWBs, CCAs, and Harnesses
• RF packaging Design Experience
• AutoCAD experience
• Zuken E3 Experience

Additional Information:

• US Citizenship is mandatory due to security clearance requirements
• Part-time remote telework available; details discussed during hiring
• Flexible work schedules, including 4×10 hour days

Company Culture:

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer committed to diversity and inclusion, emphasizing performance, courage, resilience, and precision.

Application:

The application window closes in 90 days. Applicants are encouraged to apply within 5–30 days for optimal consideration.