Electrical Systems Integration Engineer – Head Subsystem

Figureai; San Jose (CA); On-site; USD 150,000 - 250,000; Full time

Job summary

Figureai is seeking a Systems Integration Engineer in San Jose, CA, to lead the integration and validation of humanoid robot head electronics. The role involves ensuring robust power delivery and signal integrity while debugging cross-disciplinary issues.

Ideal candidates should have at least a Bachelor’s in Electrical or Systems Engineering, with 4–8+ years of experience in embedded systems integration and proficiency in Python. The role requires in-office collaboration 5 days a week and offers a competitive salary range of $150,000 to $250,000 annually.

Qualifications

• 4–8+ years of experience in electrical systems integration, validation, or test for embedded or robotic systems.
• Strong understanding of power systems, power regulation, grounding, and signal integrity.
• Hands-on experience with thermal validation using oscilloscopes and DAQs.

Responsibilities

• Lead electrical integration of the head subsystem across various interfaces.
• Plan and execute system-level validation of power delivery and thermal performance.
• Document procedures and integration learnings to support production scaling.

Skills

Electrical systems integration

Validation for embedded systems

Signal integrity

Python for automation

Education

Bachelor’s in Electrical or Systems Engineering

Tools

Oscilloscopes

Power analyzers

Job description

Figure is an AI robotics company developing autonomous general-purpose humanoid robots. The goal of the company is to ship humanoid robots with human level intelligence. Its robots are engineered to perform a variety of tasks in the home and commercial markets. Figure is based in San Jose, CA and require 5 days/week in-office collaboration.

Systems Integration Engineer – Head Subsystem to lead the bring-up, integration, and validation of the robot’s head electronics. You will own electrical integration from early prototypes through full-robot and production builds, ensuring robust power delivery, signal integrity, thermal performance, and system reliability.

Key Responsibilities

• Lead electrical bring-up and system integration of the head subsystem across embedded compute, power regulation, sensing, display, audio, and communication interfaces.
• Plan and execute subsystem and system‑level validation of power delivery, high‑speed interfaces (USB, DisplayPort, MIPI, PCIe, Ethernet, SGMII), RF, and thermal performance.
• Develop and execute electrical validation plans covering power integrity, signal integrity, EMI susceptibility, and thermal behavior.
• Debug complex cross‑disciplinary issues across hardware, firmware, and software using telemetry, oscilloscopes, DAQs, logic analyzers, and other lab instrumentation.
• Drive integration of power architectures, grounding strategies, and interface definitions to ensure reliable operation in a compact, high‑density electromechanical assembly.
• Analyze system data and define KPIs to track electrical performance, reliability, and fleet health over time.
• Document bring‑up procedures, validation workflows, test results, and integration learnings to support scaling to production and manufacturing test.

Requirements

• Bachelor’s in Electrical or Systems Engineering (or equivalent experience).
• 4–8+ years of experience in electrical systems integration, validation, or test for embedded or robotic systems.
• Strong understanding of power systems, power regulation, grounding, and signal integrity in embedded compute platforms.
• Experience with high‑speed digital and communication interfaces (USB, PCIe, Ethernet, MIPI, DisplayPort).
• Hands‑on experience with electrical and thermal validation using oscilloscopes, DAQs, power analyzers, and thermal instrumentation.
• Proficiency in Python for automation, scripting, and data analysis; familiarity with C++ a plus.
• Strong debugging, documentation, and cross‑functional collaboration skills.

Preferred Experience

• Experience integrating embedded compute, displays, RF, or audio systems in robotics, automotive, aerospace, or consumer electronics.
• Background in EMI/EMC testing, mitigation, or compliance support.
• Experience with thermal management and cooling strategies in dense electronic assemblies.
• Familiarity with manufacturing bring‑up, factory test development, or sustaining engineering.
• Willingness to travel occasionally for on‑site integration or manufacturing support.

The US base salary range for this full‑time position is between $150,000 and $250,000 annually.

The pay offered for this position may vary based on several individual factors, including job‑related knowledge, skills, and experience. The total compensation package may also include additional components/benefits depending on the specific role. This information will be shared if an employment offer is extended.