Electrical Engineering Co-op: PCB & Hardware Design

GE Appliances, a Haier company; Louisville (KY); On-site; USD 28,000 - 41,000; Full time

Benefits offered by this job

Housing assistance

Relocation assistance

Job summary

GE Appliances, a Haier company, invites you to join the Fall 2027 Electrical Engineering Co-op in Louisville, KY. You will collaborate with a mentor to design, build, and learn across multiple product areas, including refrigeration and cooking equipment.

This rotating program offers hands-on assignments and professional development opportunities. Applicants must be enrolled in an accredited engineering program (Electrical), plan to graduate May 2028 or later, and maintain a minimum 3.0 GPA.

Qualifications

• Currently enrolled in a university pursuing a bachelor's degree in Electrical Engineering.
• May 2028 or later graduation date.
• Cumulative GPA >= 3.0 (out of 4.0).
• Legal authorization to work in the United States; no visa sponsorship available.

Responsibilities

• Work with your assignment leader to accomplish objectives and goals.
• Complete innovative technical assignments in product areas including refrigeration, washer systems and cooking products. Focus on PCB design, hardware design, and hardware debugging.
• Work on new innovations and equipment.
• Participate in development and training to enhance technical and professional skills.

Skills

Interpersonal skills

Analytical skills

Communication skills

Desire to learn

Passion for engineering

Education

Bachelor's degree in Engineering (Electrical Engineering)

Tools

PCB design

Job description

GE Appliances, a Haier company, invites you to join the Fall 2027 Electrical Engineering Co-op in Louisville, KY. You will collaborate with a mentor to design, build, and learn across multiple product areas, including refrigeration and cooking equipment.

This rotating program offers hands-on assignments and professional development opportunities. Applicants must be enrolled in an accredited engineering program (Electrical), plan to graduate May 2028 or later, and maintain a minimum 3.0 GPA.