Dry Etch Manufacturing Engineer

Headway Technologies Inc; Milpitas (CA); On-site; USD 121,000 - 178,000; Full time

Job summary

Headway Technologies Inc. in Milpitas, CA is seeking a Dry Etch Manufacturing Engineer. You will develop and implement dry etch processes (RIE, IBE, ashing) for next-gen magnetic recording heads, design wafer experiments, analyze data, and report results.

You will drive cost reduction and yield improvements while transitioning new products into production. The role requires collaboration with process/product engineering, equipment teams, and suppliers.

Qualifications

• Experience with Statistical Process Control (SPC) in manufacturing.
• Knowledge of wafer fabrication processing and integration practices.
• Familiarity with data analysis tools (Excel, JMP; VBA as needed).
• Strong communication and collaboration across teams.

Responsibilities

• Develops and implements dry/plasma etch processes for next-gen heads.
• Reviews characterization data (TEM, SEM, FIB) for root-cause analysis.
• Implements process control schemes to ensure manufacturability.
• Transition new products into production with proper documentation.
• Collaborates with equipment/maintenance to minimize downtime and integrate tools.

Skills

SPC knowledge

Wafer fab experience

Data analysis

Effective communication

Education

Bachelor’s degree in Materials Science, Physics, or Electrical Engineering

Master’s degree preferred

Tools

Excel

JMP

VBA

Job description

TITLE: DRY ETCH MANUFACTURING ENGINEERFLSA STATUS: EXEMPTREPORTS TO: SR. MANAGER, DRY ETCH MANUFACTURING ENGINEERINGSUMMARY:Under the direction of the Sr. Manager Dry Etch Manufacturing Engineering, the Dry Etch Manufacturing Engineer is responsible for the developing and implementing new dry etch processes (RIE, IBE, ashing, etc.) for next generation magnetic recording heads, including designing and conducting wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.ESSENTIAL FUNCTIONS:Develops and implements new dry/plasma etch processes (RIE, IBE, ashing, etc.), for next generation magnetic recording headsReviews characterization data from FIB, SEM, and TEM to conduct root cause analysis and recommend corrective actionImplements new process control schemes or methodologies which ensure product manufacturabilityDevelops and implements practices or methodologies which reduce cost and improve operational efficiencyDevelops and implements processes or procedures for transitioning new products into the production lineReviews, updates, and maintains documentation and process instructionsInteracts with suppliers and vendors to ensure that appropriate materials or supplies are readily available for line useInstructs operators and technicians on processes and procedures, including modifications to existing proceduresPartners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production lineDesigns and conducts experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test resultsPartners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yieldResponds to inquiries from other team members, managers, or departmentsAdheres to all safety policies and procedures as requiredMINIMUM QUALIFICATIONS:Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferredThree years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process EngineerExperience in plasma etch process development (RIE, IBE, ashing, etc.) is preferredExperience working in a wafer fab manufacturing environmentExperience with Statistical Process Control (SPC)Proficient in the use of Microsoft Office ApplicationsKnowledge, Skills, and Abilities:Knowledge of semiconductor or HDD industry principles, practices, and techniquesKnowledge of wafer fabrication processing techniques, including process development and integration practicesKnowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniquesKnowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failureKnowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate actionKnowledge and ability to use Microsoft Office applications to create reports and presentationsAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritizeThe annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.WORKING CONDITIONS:The Dry Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.