DRAM Thin‑Film Process Engineer Intern

Micron Technology, Inc.; Boise (ID); On-site; USD 28,000 - 41,000; Full time

Job summary

Micron Technology, Inc. invites a DRAM Thin Films Process Engineering Intern to join our team. You will work with experienced engineers on a high‑impact summer project focused on semiconductor process development and optimization.

This role offers hands-on experience with experimental design, data analysis, and presenting results to technical and leadership audiences. You will contribute to real engineering challenges and gain exposure to AI-enabled tooling and cross‑functional collaboration.

Qualifications

• Pursuing a Ph.D. in Materials Science or Chemical Engineering.
• Knowledge of semiconductor processing, thin films, or related technologies.
• Experience crafting experiments and data analysis.
• Interest in AI, data science or digital engineering tools.
• Strong analytical and collaborative skills.

Responsibilities

• Research and develop solutions for next‑generation memory tech and thin film processing.
• Develop and analyze experiments to improve process performance.
• Apply statistical analysis and AI-enabled tools to identify trends and accelerate decisions.
• Collaborate with process, equipment, and integration teams to solve challenges.
• Communicate objectives, findings and recommendations through reports and presentations.

Skills

Semiconductor processing

Data analysis

AI / data science

Statistical analysis

Communication

Education

Ph.D. in Materials Science

Ph.D. in Chemical Engineering

Tools

Python

MATLAB

JMP

Job description

Micron Technology, Inc. invites a DRAM Thin Films Process Engineering Intern to join our team. You will work with experienced engineers on a high‑impact summer project focused on semiconductor process development and optimization.

This role offers hands-on experience with experimental design, data analysis, and presenting results to technical and leadership audiences. You will contribute to real engineering challenges and gain exposure to AI-enabled tooling and cross‑functional collaboration.