DRAM Dry Etch Principal Engineering Lead - Micron Technology

OpenTalent; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Job summary

Micron Technology is seeking a DRAM Dry Etch Principal Engineering Lead to provide technical and strategic leadership for next-generation plasma dry etch process and equipment development. You will influence DRAM technology roadmaps and lead cross-functional programs from concept to high-volume manufacturing.

The role requires 7+ years in semiconductor process development with strong plasma etch expertise, and the ability to mentor teams and collaborate with suppliers to deliver innovative

Qualifications

• Lead multi-functional projects and coordinate with internal and external collaborators.
• Bachelor-level technical degree required; 7+ years in semiconductor process development.
• Expertise in plasma etch fundamentals, reactor operation, and root cause analysis.

Responsibilities

• Lead the development and optimization of advanced plasma dry etch processes for next-generation DRAM technologies.
• Define technical strategies and roadmaps for dry etch process and equipment development.
• Drive process capability, yield, and reliability improvements through data-driven experimentation.
• Partner with teams to transfer new technologies into production.
• Mentor engineers and foster collaboration, safety, and technical excellence.

Skills

Leadership

Project management

Data-driven problem solving

Education

Bachelor's degree in Engineering/Physics/Materials Science/Chemical Engineering

MS/PhD preferred

Tools

Plasma dry etch

Process characterization

Statistical data analysis

Job description

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron, our DRAM Process Development team is at the forefront of advancing memory technology that powers innovation around the world. We work collaboratively across engineering, manufacturing, and research organizations to develop breakthrough solutions that enable future generations of high-performance memory products. Our team values technical excellence, continuous learning, and a culture of safety, inclusion, and innovation.

As a DRAM Dry Etch Principal Engineering Lead, you will provide both technical and strategic leadership for next-generation plasma dry etch process and equipment development. This role offers the opportunity to influence DRAM technology roadmaps. You will lead complex development programs and work with multi-functional teams and suppliers. The goal is to deliver innovative solutions from concept through high-volume manufacturing.

Responsibilities:

• Lead the development and optimization of advanced plasma dry etch processes for next-generation DRAM technologies
• Define technical strategies and roadmaps for dry etch process and equipment development
• Drive process capability, yield, and reliability improvements through data-driven experimentation and structured problem solving
• Partner with integration, manufacturing, equipment, and supplier teams to develop, qualify, and transfer new technologies into production
• Mentor engineers, support talent development, and foster a culture of collaboration, safety, and technical excellence

Minimum Qualifications:

• Bachelor’s degree or equivalent experience in Engineering, Physics, Materials Science, Chemical Engineering, or a related technical field
• 7+ years of semiconductor process development experience, including significant experience in plasma dry etch technology
• Strong expertise in plasma etch fundamentals, reactor operation, process characterization, and root cause analysis
• Experience with experimental design, statistical data analysis, and process optimization methodologies
• Proven ability to lead multi-functional projects and communicate effectively with internal and external collaborators

Preferred Qualifications:

• M.S. or Ph.D. in Engineering, Physics, Materials Science, Chemical Engineering, or a related technical field
• Experience developing advanced DRAM, 3D device, or other groundbreaking semiconductor technologies
• Demonstrated success leading technical teams, mentoring engineers, or managing complex development programs