Distinguished Technologist Mechanical Engineer (Network Infrastructure)

Hewlett Packard Enterprise; Sunnyvale (CA); On-site; USD 163,000 - 347,500; Full time

Benefits offered by this job

Health and wellness programs

Professional development opportunities

Culture of unconditional inclusion

Job summary

Hewlett Packard Enterprise is seeking a Distinguished Mechanical Engineer in Sunnyvale, California, to lead the mechanical architecture and design of complex networking systems. The ideal candidate should have over 15 years of relevant experience, particularly in electromechanical product development.

Responsibilities include leading cross-functional teams, driving technical decisions, and mentoring junior engineers. A competitive annual salary range of USD 163,000 - 347,500 is provided along with a complete suite of benefits ensuring overall wellbeing.

Qualifications

• 15+ years of experience in electromechanical product development.
• Extensive experience with chassis development and system packaging.

Responsibilities

• Lead the mechanical development of complex networking systems.
• Evaluate and integrate new technologies for product roadmaps.
• Drive system-level technical decisions across multiple projects.

Skills

3D solid modeling tools

Tolerance analysis

GD&T

Sheet metal design

Advanced cooling technologies

Education

BS in Mechanical Engineering or equivalent

MS in Mechanical Engineering or equivalent

Tools

SolidWorks

EPDM or equivalent PLM systems

Job description

Job Description

Reporting to the Head of Mechanical Engineering, the Distinguished Mechanical Engineer will be a self‑motivated technical leader capable of working in a fast‑paced environment with aggressive product development schedules. The role involves the mechanical architecture, design, development, and qualification of complex networking systems from concept through production and field deployment.

Responsibilities

• Lead the mechanical development of complex networking systems and chassis platforms from concept through production release and field support.
• Provide technical leadership across multiple programs and serve as a subject‑matter expert for mechanical architecture, packaging, manufacturability, reliability, and serviceability.
• Evaluate and integrate new technologies in cooling, liquid cooling, interconnects, materials, and manufacturing processes to support future product roadmaps.
• Drive system‑level technical decisions, balancing performance, cost, schedule, reliability, manufacturability, compliance, and customer requirements.
• Remain actively engaged in hands‑on engineering activities, including CAD reviews, tolerance analysis, prototype evaluation, laboratory testing, failure analysis, and root‑cause investigations.
• Lead cross‑functional design reviews and collaborate closely with Electrical, Thermal, Signal Integrity, Reliability, Manufacturing, Operations, and Supply Chain teams.
• Drive technical content of system specifications, design guidelines, validation plans, and engineering standards.
• Develop and maintain mechanical design standards, best practices, and engineering methodologies across the organization.
• Identify technical risks and drive mitigation plans throughout the product development lifecycle.
• Support customer escalations, manufacturing issues, and field failures through hands‑on troubleshooting and corrective action development.
• Lead supplier engagements involving design reviews, manufacturing readiness, tooling strategies, and technical issue resolution.
• Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.
• Mentor and develop engineers through technical coaching, design reviews, and day‑to‑day engineering leadership.
• Contribute to long‑term technology planning and future platform development initiatives.

Education

• BS in Mechanical Engineering or equivalent.
• 15+ years of experience in electromechanical product development.
• Extensive experience with chassis development, system packaging, and high‑density electronic assemblies.

Preferred Qualifications

• MS in Mechanical Engineering or equivalent.
• Experience developing networking, server, storage, telecommunications, or high‑performance computing systems.
• Experience with advanced cooling technologies, including liquid cooling solutions.
• Demonstrated leadership of complex cross‑functional development programs.

Expected Competencies

• Expert‑level proficiency with 3D solid modeling tools; SolidWorks experience preferred. Working knowledge of EPDM or equivalent PLM systems is a plus.
• Extensive experience developing complex chassis and system‑level mechanical designs for networking, server, storage, or telecommunications products.
• Strong hands‑on experience with tolerance analysis, GD&T, stack‑up analysis, and structural analysis techniques.
• Working knowledge of FEA and interpretation of simulation results.
• Experience with ECAD‑MCAD integration and IDF workflows.
• Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes.
• Strong understanding of tooling requirements and manufacturing considerations for volume production.
• Working knowledge of thermal design principles, thermal characterization, and advanced cooling technologies including liquid cooling.
• Strong understanding of NEBS, EMI, EMC, Safety, and other regulatory compliance requirements.
• Proven ability to troubleshoot complex system‑level mechanical issues in laboratory, manufacturing, and field environments.
• Experience leading root‑cause investigations and implementing corrective actions.
• Strong understanding of product cost drivers, tooling investments, supplier capabilities, and budget management.
• Excellent communication and leadership skills with the ability to influence cross‑functional teams.
• Comprehensive understanding of the complete product development lifecycle from concept through production and field support.

Benefits

We strive to provide a comprehensive suite of benefits that support physical, financial and emotional wellbeing, including health and wellness programs, professional development opportunities, and a culture of unconditional inclusion.

Compensation

Annual Salary USD 163,000 - 347,500 in California. The listed salary range reflects base salary; variable incentives may also be offered.

EEO Statement

HPE is an Equal Employment Opportunity/Veteran/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are based on qualifications, merit, and business need. HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.