Director, Power Package Design & Wafer-Level Packaging

Renesas; San Jose (CA); On-site; USD 230,000 - 260,000; Full time

Job summary

Renesas seeks a Director of Package Design Engineering to lead development of power SiP/module packaging and advanced interconnects. You will oversee OSAT/CM partnerships, drive DOE-driven process optimization, and ensure robust production transitions for AI and datacenter applications.

Ideal candidates have extensive experience in wafer-level and flip-chip packaging, strong leadership, and the ability to manage complex cross-functional programs across global teams.

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Lead package technology development, NPI, R&D, and OSAT management for new package development and roadmap definition.
• Focus on design and development of package and interconnect methods for AI/datacenter power packaging needs, including SiC & GaN work.
• Benchmark, select and qualify materials, processes and OSAT/CM partners.
• Coordinate DOE studies with OSAT/CM to optimize processes and establish specs.
• Qualify new packages with Product groups and Reliability teams within timelines.
• Maintain production controls and monitor to prevent quality incidents.
• Ensure smooth transition to production and ramp-up monitoring.
• Address internal/external complaints with cross-functional teams to grow business.

Skills

Power SiP/module design

Wafer level packaging

Flip-chip packaging

DOE execution

OSAT collaboration

Strong communication

Analytical skills

Education

Doctorate/Masters/Bachelor in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

SPC software

DOE methodologies

OSAT/CM management

Job description

Renesas seeks a Director of Package Design Engineering to lead development of power SiP/module packaging and advanced interconnects. You will oversee OSAT/CM partnerships, drive DOE-driven process optimization, and ensure robust production transitions for AI and datacenter applications.

Ideal candidates have extensive experience in wafer-level and flip-chip packaging, strong leadership, and the ability to manage complex cross-functional programs across global teams.