Digital IC Design Engineer Intern: Shape Next-Gen ICs

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 32,000 - 52,000; Full time

Job summary

Texas Instruments is seeking a Digital IC Design Engineer Intern to help architect TI product ICs, define, model, implement and document analog, digital, and RF circuits. You will work across areas like audio, imaging, high-speed interfaces and automotive to deliver robust, cost-efficient designs.

You will partner with business teams and system engineers, develop design specs, and participate in reviews to ensure successful product releases.

Qualifications

• Pursuing a Bachelor’s degree in Electrical/Computer Engineering, Computer Engineering, or related field.
• GPA 3.0/4.0 or higher.
• Strong communication and teamwork skills preferred.

Responsibilities

• Partner with business teams and system engineering to develop design specifications.
• Provide high-level analysis on chip architecture trade-offs for spec compliance and cost.
• Participate in design reviews and create design and product documentation.
• Collaborate on IC layouts to meet high-performance standards.
• Characterize prototypes, develop test specs and coordinate with test/product engineering.
• Drive behavioral models and contribute to product releases.

Skills

Strong communication

Team collaboration

Problem solving

Time management

Initiative

Stakeholder relations

Education

Pursuing Bachelor's degree in Electrical/Computer Engineering or related field

Job description

Texas Instruments is seeking a Digital IC Design Engineer Intern to help architect TI product ICs, define, model, implement and document analog, digital, and RF circuits. You will work across areas like audio, imaging, high-speed interfaces and automotive to deliver robust, cost-efficient designs.

You will partner with business teams and system engineers, develop design specs, and participate in reviews to ensure successful product releases.