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Lancesoft seeks a Contract Worker to support installation, maintenance, and operation of next‑gen liquid‑cool AI rack infrastructure in a high‑density datacenter. You will work with direct liquid cooling, EPYC servers, and Instinct GPUs, maintaining coolant loops, cables, and rack services to ensure production workloads run continuously.
Responsibilities include LC operations, rack hardware maintenance, fabric interconnects, and firmware updates using BMC/IPMI/Redfish, with on‑site duties in a
We are seeking an experienced and highly motivated Contract Worker to support the installation, maintenance, and operational support of next-generation liquid-cooled AI rack infrastructure in a high-density datacenter environment. The ideal candidate will have direct hands‑on experience with Direct Liquid Cooling (DLC) systems, high-density compute platforms —including Instinct GPU compute trays and EPYC server nodes —and the physical plant systems (CDUs, manifolds, busbar, networking fabric) required to sustain racks operating at up to 246 kW per rack. This role supports Helios‑class rack‑scale AI infrastructure: open‑standard double‑wide (ORW) racks housing compute trays (4×Instinct MI455X GPUs + 1×EPYC Venice CPU each) and switch trays interconnected via a UALink / Ethernet fabric. The technician performs hands‑on tray‑level service, cooling system operations, firmware cycling, and physical cabling to sustain continuous availability of production AI training and inference workloads.
Liquid Cooling Operations Operate, monitor, and maintain Coolant Distribution Units (CDUs) including flow rate management (target: ~385 L/min per rack system), temperature setpoints, and alarm response. Install, replace, and pressure-test blind‑mate quick‑disconnect (QD) connectors on compute and switch trays without interrupting adjacent rack cooling circuits. Perform leak detection, containment, and remediation in accordance with site EHS protocols. Maintain secondary loop plumbing (supply/return manifolds, flexible hose assemblies, isolation valves);coordinate with facilities for primary loop support. Support rack‑level thermal assessments;contribute to coolant quality monitoring (pH, conductivity, biocide levels).
High‑Density Rack & Server Hardware Install and serviceHelios‑class compute trays (~77 kg each;576 differential connections) using approved lift equipment and torque specifications. Install and service switch trays (1, 728 connections;~310 kg insertion force) using lever‑assist handles per OEM guidance. Replace field‑replaceable units (FRUs): Instinct MI450/MI455X GPU modules, HBM4 memory, EPYC CPU+DIMM assemblies, NVMe drives, power modules, and fan trays. Execute rack‑level hot‑swap operations on busbar and power shelf components following LOTO and high‑voltage DC (HVDC) safety procedures. Cable‑manage high‑speed optical interconnects (QSFP-DD / OSFP) and DAC/AOC assemblies for UALink, Ethernet, and out‑of‑band management fabrics.
Networking & Fabric Infrastructure Patch and manage fiber/copper connections within the Broadcom Tomahawk 6‑based switch fabric supporting single‑hop, multi‑plane GPU‑to‑GPU interconnect. Validate optical power budgets and verify high‑speed links following tray moves, adds, or changes. Coordinate with network engineering for fabric topology changes and UALink / UEC configuration validation.
Monitoring, Diagnostics & Firmware Use BMC/Redfish/IPMI tools to monitor GPU and CPU health, review system event logs, and identify hardware faults proactively. Execute firmware update workflows (BIOS/UEFI, BMC, NIC, GPU firmware) following approved change management processes. RunROCm‑based diagnostic utilities (rocm‑smi, GPU benchmarks) to validate compute readiness post‑maintenance. Interface with DCIM and BMS platforms (e.G., Schneider EcoStruxure, Motivair CDU telemetry) to track PUE, coolant flow, and rack‑level power draw (up to 246 kW/rack).
Documentation & Compliance Maintain accurate asset inventory, maintenance logs, and incident records in the CMDB/ticketing system. Follow EHS, physical security, and datacenter access procedures at all times. Contribute to runbooks, SOP updates, and lessons‑learned documentation after significant incidents or deployments. Participate in on‑call rotation for after‑hours critical hardware incidents.
Skill Area Details Status
Minimum: 4–5 years in a datacenter infrastructure or datacenter operations (DCO) technician role Must Have 4+ years hands‑on experience with Direct Liquid Cooling (DLC) systems in production datacenter environments, including CDU operation and coolant loop maintenance. 4+ years experience with enterprise server hardware installation and break/fix servicing at component level (CPU, DIMM, GPU, storage, NIC). Demonstrated experience with high‑density rack platforms (≥20 kW/rack) including cabling, power distribution, and liquid‑cooling integration. Proven ability to follow and enforce LOTO, EHS, and physical security procedures in a critical facility environment. Experience with out‑of‑band server management (BMC, IPMI, Redfish, iDRAC, iLO, or equivalent). Familiarity with high‑speed fiber optics (LC/MPO, QSFP-DD/OSFP) including cleaning, inspection, and patch panel management. Strongly Preferred 2+ years experience with GPU compute infrastructure (Instinct, NVIDIA HGX, or equivalent OAM/SXM form factors). Experience with EPYC server platforms (1P/2P) including BIOS, memory population, and diagnostic procedures. Familiarity with OCP Open Rack / ORW standards and open datacenter architectures. Exposure to AI or HPC datacenter deployments with cluster‑scale interconnects (InfiniBand, Ethernet RoCE, or UALink). Working knowledge ofROCm software stack for hardware validation tasks. Nice to Have BICSI RCDD, DCIS, or equivalent datacenter infrastructure certification. CompTIA Server+, Linux+, or similar vendor/industry certifications. Experience with Schneider Electric EcoStruxure, Motivair, or Vertiv CDU/DCIM platforms. Familiarity with change management frameworks (ITIL) and CMDB tooling (ServiceNow or equivalent).
Ability to lift and maneuver equipment up to 50 lbs (23 kg) unassisted;team‑lift required for compute trays (~77 kg) and switch trays (~120 kg with tooling). Ability to stand, bend, kneel, and work in confined rack spaces for extended periods. Comfort working in raised‑floor and hot/cold‑aisle-contained datacenter environments. Manual dexterity sufficient to handle fine connectors, optical fibers, and small form‑factor electronics.
This position is on‑site at a high‑density AI datacenter facility operating Helios‑class rack‑scale infrastructure. Racks operate at up to 246 kW with fully liquid‑cooled compute and switch trays. The environment involves high electrical density, pressurized coolant loops, heavy mechanical components, and stringent physical security controls. Candidates must be comfortable in this environment and committed to strict adherence to safety protocols. Typical schedule is Monday–Friday with participation in an on‑call rotation for critical‑path incidents outside standard business hours. Shift work may be required during large‑scale deployments or datacenter expansions.
This is a contract worker (CW) engagement. The position does not carry employee benefits or implied conversion guarantees unless separately agreed in writing. The CW will be engaged through an approved staffing agency and will work under the direction of the datacenter operations team. All work will be performed on‑site at the designated datacenter facility.