Data Center AI Hardware Technical Lead – Rack Scale Design

Qualcomm

Austin (TX)

On-site

USD 163,000 - 244,000

Full time

14 days+
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Job summary

Qualcomm Technologies, Inc. is seeking an experienced Technical Lead for the Data Center AI System Hardware and Validation Engineering team in Austin to drive rack-scale designs and validation.

You will coordinate cross-functional hardware, firmware, and software teams, manage requirements and schedules, and deliver robust AI hardware solutions for next-generation data centers.

Qualifications

  • Master’s degree in computer science/engineering or related field.
  • 8+ years of experience in systems or hardware engineering.
  • Experience with rack-level systems and components.
  • Experience with cross-functional teams and technical programs.
  • Proficient with defect-tracking tools and MS Office.

Responsibilities

  • Lead execution for next-generation Qualcomm rack-scale designs.
  • Define and manage requirements, scope, schedules, and deliverables.
  • Own rack-level integration plans across compute nodes, PCIe fabrics, networking, storage, power delivery, cooling, and telemetry.
  • Drive firmware/software/hardware co-design and validation gates.
  • Lead design reviews and readiness reviews.
  • Coordinate platform-level debug and instrumentation.
  • Define and track program KPIs and publish dashboards.
  • Identify risks and drive mitigation and closure.

Skills

Technical leadership
Systems engineering
Hardware project management
Rack-scale know-how
Cross-functional collaboration
Agile methods

Education

Bachelor’s degree
Master’s degree
PhD

Tools

JIRA
Confluence
SharePoint
Microsoft Office

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

The Qualcomm Data Center AI System Hardware and Validation Engineering team develops rack-level AI inference solutions for next-generation, liquid‑cooled data centers. As the organization continues to grow, the team is seeking experienced Technical Leads to help deliver the next wave of innovative AI products.

Responsibilities
  • Lead execution for next‑generation Qualcomm rack‑scale designs within a matrixed organization spanning multiple teams and global sites.
  • Define and manage requirements, scope, schedules, and deliverables in alignment with engineering teams, partners, and stakeholders.
  • Own rack‑level integration plans across compute nodes/accelerators, PCIe fabrics, networking, storage, power delivery, cooling, and rack management/telemetry.
  • Drive firmware/software/hardware co‑design execution, aligning BIOS/BMC/Redfish/telemetry requirements with hardware schedules and validation gates.
  • Lead cross‑functional design reviews and readiness reviews (architecture, schematic/layout, SI/PI, thermal, mechanical, firmware, manufacturing), and close actions to schedule.
  • Coordinate platform‑level debug and instrumentation (telemetry, logging, health monitoring) to accelerate failure analysis and improve observability.
  • Establish and run triage mechanisms (issue intake, prioritization, defect metrics) and drive issues to root cause, corrective action, and verified closure.
  • Define and track program‑level KPIs (schedule health, build quality, defect trends, coverage, yield, reliability) and publish executive dashboards and weekly program reviews.
  • Identify program risks, drive mitigation plans, and manage scope changes while proactively communicating status and decisions to stakeholders.
Preferred Qualifications
  • Master’s degree in computer science/engineering, electrical engineering, or a related field.
  • 8+ years of experience in systems or hardware engineering, hardware project lifecycle management, and technical product/program management.
  • Experience with rack level systems and components.
  • Proven experience collaborating with technical teams to develop systems, solutions, and products.
  • Experience managing technical programs across cross‑functional teams, establishing processes, and coordinating release schedules, and working in large, matrixed organizations.
  • Demonstrated proficiency with Microsoft Office applications, SharePoint, JIRA/Confluence, and other defect‑tracking tools.
  • Persuasive communication, organizational, coordination, multi‑tasking, and documentation skills.
  • Experience with server technologies, including board design, SIPI, thermal and mechanical aspects, BIOS, BMC, and networking.
  • Familiarity with Agile methods and practices.
  • Experience working with CMs, OEMs, ODMs, and suppliers in product development.
  • Strong cross‑functional communication skills, with experience managing complex program lifecycles, building sustainable processes, and coordinating release schedules.
Minimum Qualifications
  • Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
  • Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
  • PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
EEO Employer

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Pay range and Other Compensation & Benefits

$162,600.00 - $244,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

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